Antenna Structure Forming on Non-Conductive Frame

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Solution Overview

Problem

Conventional antenna assembly processes in mobile phones are time-consuming and costly due to the need for fixing thin metal pieces to plastic housings.

Innovation Solution

A method involving a non-conductive frame coated with a plating resist material, where a predetermined region is laser-marked to create a roughened surface, allowing for the deposition of a medium layer and subsequently a metal layer to form a patterned antenna structure through electroless deposition.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If thin metal pieces are fixed to plastic housing using conventional assembly processes, then antenna functionality is achieved, but production time and cost increase

Engineering Contradiction:
Improveantenna functionalityVSAvoidassembly time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent merges the antenna metal layer directly with the plastic housing by integrating the metal deposition process into the molding process. The metal layer is formed in-situ on the housing surface through electroless plating, eliminating the separate assembly step of fixing pre-made antenna pieces. This combining of materials and processes reduces both time and complexity while maintaining antenna functionality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent applies preliminary action by pre-forming the metal layer on the housing surface before final assembly. The electroless plating process deposits the metal pattern onto the housing in advance, creating a pre-integrated structure that eliminates subsequent assembly operations. This preliminary formation of the antenna structure directly addresses the time loss issue.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If thin metal pieces are fixed to plastic housing using conventional assembly processes, then antenna functionality is achieved, but production cost increases

Engineering Contradiction:
Improveantenna functionalityVSAvoidproduction cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines the antenna metal layer formation with the housing manufacturing process itself. By using electroless plating to deposit metal directly onto the molded housing, the patent eliminates separate antenna component fabrication and assembly operations. This merging of processes reduces labor costs, assembly equipment requirements, and overall manufacturing complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The electroless plating process is self-service in that it automatically deposits metal onto the housing surface through chemical reaction without requiring complex mechanical assembly equipment or manual operations. The process uses chemical energy to drive metal deposition, reducing the need for expensive assembly machinery and skilled labor.

Inventive Principle:
Principle #25Self-service

3Strength

If plating resist material is disposed on non-conductive frame and laser marking is applied, then metal layer bonding is improved, but process complexity increases

Engineering Contradiction:
Improvemetal layer bondingVSAvoidprocess complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The plating resist material serves as an intermediary that enables selective metal deposition. It temporarily covers areas where metal should not be deposited, allowing the electroless plating process to occur only on exposed regions. This intermediary material simplifies the overall process by enabling patterned deposition without requiring complex masking or positioning equipment.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces complex mechanical assembly systems with a chemical process (electroless plating). Instead of mechanically fixing metal pieces to the housing, the metal layer is chemically deposited onto the housing surface. This substitution of mechanical operations with a chemical process reduces equipment complexity while improving bonding strength.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method simplifies the assembly process and reduces production costs by firmly bonding the metal layer to the non-conductive frame, enabling efficient and cost-effective antenna formation.

Implementation Method 1

forming a roughened surface of the non-conductive frame within the predetermined region by laser marking

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

forming a metal layer on the medium layer

Methodology Applied
Scientific EffectElectroless deposition: Electroplating

Data Source

PatentUS8176621B2Method for forming antenna structure
Publication Date: 2012.05.15 WISTRON NEWEB CORP
  • US8176621B2 patent drawing
  • US8176621B2 patent drawing
  • US8176621B2 patent drawing

AI summary

A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and disposing a plating resist material on the non-conductive frame, removing a part of the plating resist material within a predetermined region on the non-conductive frame and forming a roughened surface on the non-conductive frame within the predetermined region by laser marking, forming a medium layer on the roughened surface, wherein the medium layer comprises Pd or Ag, removing the plating resist material on the non-conductive frame, and forming a metal layer on the medium layer.