Antenna Structure Forming on Non-Conductive Frame
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Solution Overview
Problem
Conventional antenna assembly processes in mobile phones are time-consuming and costly due to the need for fixing thin metal pieces to plastic housings.
Innovation Solution
A method involving a non-conductive frame coated with a plating resist material, where a predetermined region is laser-marked to create a roughened surface, allowing for the deposition of a medium layer and subsequently a metal layer to form a patterned antenna structure through electroless deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thin metal pieces are fixed to plastic housing using conventional assembly processes, then antenna functionality is achieved, but production time and cost increase
Solution Approach 1:
The patent merges the antenna metal layer directly with the plastic housing by integrating the metal deposition process into the molding process. The metal layer is formed in-situ on the housing surface through electroless plating, eliminating the separate assembly step of fixing pre-made antenna pieces. This combining of materials and processes reduces both time and complexity while maintaining antenna functionality.
Solution Approach 2:
The patent applies preliminary action by pre-forming the metal layer on the housing surface before final assembly. The electroless plating process deposits the metal pattern onto the housing in advance, creating a pre-integrated structure that eliminates subsequent assembly operations. This preliminary formation of the antenna structure directly addresses the time loss issue.
2Reliability
If thin metal pieces are fixed to plastic housing using conventional assembly processes, then antenna functionality is achieved, but production cost increases
Solution Approach 1:
The patent combines the antenna metal layer formation with the housing manufacturing process itself. By using electroless plating to deposit metal directly onto the molded housing, the patent eliminates separate antenna component fabrication and assembly operations. This merging of processes reduces labor costs, assembly equipment requirements, and overall manufacturing complexity.
Solution Approach 2:
The electroless plating process is self-service in that it automatically deposits metal onto the housing surface through chemical reaction without requiring complex mechanical assembly equipment or manual operations. The process uses chemical energy to drive metal deposition, reducing the need for expensive assembly machinery and skilled labor.
3Strength
If plating resist material is disposed on non-conductive frame and laser marking is applied, then metal layer bonding is improved, but process complexity increases
Solution Approach 1:
The plating resist material serves as an intermediary that enables selective metal deposition. It temporarily covers areas where metal should not be deposited, allowing the electroless plating process to occur only on exposed regions. This intermediary material simplifies the overall process by enabling patterned deposition without requiring complex masking or positioning equipment.
Solution Approach 2:
The patent replaces complex mechanical assembly systems with a chemical process (electroless plating). Instead of mechanically fixing metal pieces to the housing, the metal layer is chemically deposited onto the housing surface. This substitution of mechanical operations with a chemical process reduces equipment complexity while improving bonding strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the assembly process and reduces production costs by firmly bonding the metal layer to the non-conductive frame, enabling efficient and cost-effective antenna formation.
Implementation Method 1
forming a roughened surface of the non-conductive frame within the predetermined region by laser marking
Implementation Method 2
forming a metal layer on the medium layer
Data Source
AI summary
A method for forming an antenna structure is provided, including the following steps of: providing a non-conductive frame and disposing a plating resist material on the non-conductive frame, removing a part of the plating resist material within a predetermined region on the non-conductive frame and forming a roughened surface on the non-conductive frame within the predetermined region by laser marking, forming a medium layer on the roughened surface, wherein the medium layer comprises Pd or Ag, removing the plating resist material on the non-conductive frame, and forming a metal layer on the medium layer.


