Antenna Module Lateral Shielding for EMI Reduction
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Solution Overview
Problem
Conventional antenna modules face interference from electromagnetic waves, which affect the chip's performance, and there is a need for effective shielding to mitigate this issue.
Innovation Solution
The antenna module incorporates a conductive layer on the dielectric lateral surface that electrically connects to a grounding layer, extending towards the antenna layer but not contacting the dielectric surface, thereby shielding electromagnetic waves without degrading antenna gain and reducing module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional antenna module is used, then the structure is simple, but the chip is easily interfered by electromagnetic waves
Solution Approach 1:
The conductive layer is extended from the traditional planar grounding configuration into the three-dimensional space by forming it on the lateral surface of the dielectric layer. This vertical extension creates a shielding barrier in the lateral dimension, effectively blocking electromagnetic waves from reaching the chip while maintaining structural integration.
Solution Approach 2:
The conductive layer serves as an intermediary shielding element positioned between the electromagnetic wave source and the chip. It acts as a protective barrier that intercepts and redirects electromagnetic waves, preventing them from directly interfering with the chip while being electrically connected to the grounding layer for effective charge dissipation.
2Reliability
If shielding structures are added to protect the chip, then electromagnetic interference is reduced, but the module size increases
Solution Approach 1:
The shielding function is merged with the existing dielectric layer structure by forming the conductive layer on its lateral surface. This integration allows the shielding function to be achieved without adding separate shielding components, thereby preventing increase in module volume while maintaining effective electromagnetic protection.
Solution Approach 2:
Instead of expanding the shielding structure in the horizontal plane which would increase module footprint, the conductive layer is positioned vertically on the lateral surface of the dielectric layer. This three-dimensional configuration provides effective shielding while maintaining a compact module size.
3Reliability
If the conductive layer contacts the dielectric surface, then shielding is enhanced, but antenna gain degrades
Solution Approach 1:
The conductive layer is positioned on the lateral surface of the dielectric layer rather than contacting the top dielectric surface where the antenna operates. This localized positioning provides shielding effectiveness in the lateral direction while avoiding interference with the antenna's electromagnetic field distribution and gain characteristics.
Solution Approach 2:
The dielectric layer's lateral surface serves as an intermediary position for the conductive layer, allowing it to provide shielding without directly contacting the antenna structure. This intermediate positioning enables the conductive layer to block electromagnetic waves from reaching the chip while maintaining proper antenna radiation patterns and gain.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively shields electromagnetic waves, reducing antenna gain degradation by 0.2 dB while maintaining a 17% reduction in module size, thus enhancing the module's performance and reliability.
Implementation Method 1
The conductive layer is formed on the first dielectric lateral surface of first dielectric layer, wherein the conductive layer electrically connects to the grounding layer and extends from the grounding layer toward the first antenna layer but not contacts the first dielectric surface
Data Source
AI summary
An antenna module includes a first dielectric layer, an antenna layer, a grounding layer and a conductive layer. The first dielectric layer has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface and a first dielectric lateral surface extending between the first dielectric surface and the second dielectric surface. The antenna layer is formed on the first dielectric surface. The grounding layer is formed below the second dielectric surface. The conductive layer is formed on the first dielectric lateral surface of first dielectric layer, wherein the conductive layer electrically connects to the grounding layer and extends from the grounding layer toward the antenna layer but not contacts the first dielectric surface.


