Side-Member Antenna Layout With Split Insulators for Interference Spacing

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Solution Overview

Problem

The presence of a nonconductive material in the side member of electronic devices can cause interference between the conductive pattern and other electronic components, leading to degraded antenna radiation performance due to reduced spacing and increased thickness of nonconductive injection-molded materials.

Innovation Solution

The thickness of the nonconductive injection-molded material is minimized, and a predetermined distance is maintained between the conductive pattern and other electronic components by using a reduced thickness of the nonconductive member and incorporating inclined surfaces on the non-conductive member or conductive pattern to enhance spacing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a nonconductive injection-molded material is disposed between the side member and the conductive pattern, then the conductive pattern is protected and electrically isolated, but the thickness of the nonconductive material increases, reducing the distance from other electronic components and causing interference

Engineering Contradiction:

Improveantenna radiation performanceVSAvoiddistance between conductive pattern and electronic component

Core Design Contradiction:

ReliabilityVSLength of moving object

Solution Approach 1:

The nonconductive member is divided into two distinct parts: a first nonconductive member that bonds the conductive pattern to the side member, and a second nonconductive member with reduced thickness that maintains spacing from electronic components. This segmentation allows each part to optimize its function without compromising the other.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the nonconductive member have different thickness characteristics. The first nonconductive member has sufficient thickness for electrical isolation and bonding, while the second nonconductive member has reduced thickness in specific areas to maintain adequate distance from electronic components without excessive material usage.

Inventive Principle:

Principle #3Local quality

2Reliability

If the thickness of the nonconductive injection-molded material is increased, then electrical isolation and bonding are improved, but the distance between the conductive pattern and other electronic components is reduced, causing interference

Engineering Contradiction:

Improvebonding strength and electrical isolationVSAvoidinterference between conductive pattern and electronic component

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The nonconductive member is segmented into a first portion for bonding and isolation functions, and a second portion for spacing functions. This allows the bonding region to have sufficient thickness for electrical isolation while the spacing region maintains appropriate distance from electronic components.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The nonconductive member acts as an intermediary structure between the conductive pattern and both the side member and electronic components. It provides the necessary electrical isolation and mechanical bonding while maintaining spatial separation to prevent interference.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Length of moving object

If the thickness of the nonconductive member is reduced, then the distance to electronic components is increased and interference is reduced, but bonding strength and electrical isolation may be compromised

Engineering Contradiction:

Improvedistance between conductive pattern and electronic componentVSAvoidbonding strength and electrical isolation

Core Design Contradiction:

Length of moving objectVSStrength

Solution Approach 1:

The nonconductive member is divided into a first nonconductive member optimized for bonding strength and electrical isolation, and a second nonconductive member optimized for maintaining distance from electronic components. Each segment is designed with appropriate thickness for its specific function.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The nonconductive member exhibits local quality variations where the first portion has greater thickness for bonding and isolation, while the second portion has reduced thickness for spacing, allowing each region to optimize its specific function.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS12477051B2Electronic device including antenna and method for manufacturing the same

Publication Date: 2025.11.18 SAMSUNG ELECTRONICS CO LTD

AI summary

An electronic device may include a housing including a front plate, a rear plate, and a side member surrounding a space formed by the front plate and the rear plate, a support member disposed in the space, at least one electronic component disposed in the space, a first non-conductive member disposed on at least a portion of the support member and on the side member, a conductive pattern at least partially disposed between the side member and the first non-conductive member, and a second non-conductive member disposed between the side member and a portion of the conductive pattern and a portion of the first non-conductive member, at least a portion of the conductive pattern may be spaced apart from the at least one electronic component by a predetermined distance, and a first inclined surface may be formed on a portion of the first non-conductive member.