Antenna Systems with Low Passive Intermodulation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing antenna systems face challenges in achieving low passive intermodulation (PIM), good bandwidth, and isolation while maintaining a compact size, particularly in multi-antenna configurations used in infrastructure and customer premises equipment, where size and space limitations are restrictive.
Innovation Solution
The antenna system incorporates a ground plane with parasitic elements and unique isolator configurations, uses non-ferromagnetic materials, and minimizes galvanic contact through dielectric adhesive tapes and reduced soldering areas to achieve low PIM, enhanced bandwidth, and improved isolation, accommodating both pigtail and fixed connector types.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple antennas are placed in close proximity to increase capacity and coverage, then device capacity and coverage are improved, but passive intermodulation (PIM) increases and isolation between antennas deteriorates
Solution Approach 1:
A ground plane is introduced as an intermediary structure between multiple antennas. The ground plane serves as a reference plane that improves isolation between antennas and reduces passive intermodulation effects, allowing antennas to be placed in close proximity while maintaining signal integrity and reducing harmful interactions.
2Volume of moving object
If antenna size is reduced to meet compact device requirements, then device size is improved, but bandwidth and performance are deteriorated
Solution Approach 1:
The ground plane parameters (size, shape, position, and electrical properties) are optimized to compensate for the reduced antenna size. By adjusting the ground plane characteristics, the system maintains adequate bandwidth and performance metrics even with compact antenna dimensions, resolving the trade-off between size and performance.
3Ease of manufacture
If conventional antenna designs are used to simplify manufacturing, then ease of manufacture is improved, but passive intermodulation and isolation performance are deteriorated
Solution Approach 1:
The ground plane acts as a mediator that addresses PIM and isolation issues without requiring complex antenna structures. This approach maintains manufacturing simplicity while improving performance, as the ground plane can be easily integrated into conventional antenna designs through standard PCB fabrication or mounting techniques.
Data Source
AI summary
According to various aspects, exemplary embodiments are disclosed of antenna systems. In an exemplary embodiment, an antenna system generally includes a ground plane and first and second antennas. A first isolator is disposed between the first and antennas. A second isolator extends outwardly from the ground plane. The antenna system is configured to be operable with low passive intermodulation.