Antenna Module With Adhesive Air Gaps For 5G Path Loss Reduction
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Solution Overview
Problem
Conventional antenna modules for 5G communication systems using ultra-high frequency bands suffer from increased loss and degraded performance due to the separation of antennas and chipsets connected via cables, leading to path loss and manufacturing breakdowns.
Innovation Solution
An antenna module is designed with heterogeneous material base substrates adhered using an adhesive substrate with air gap holes, allowing for the formation of air gaps between radiation patterns, which prevents breakdown and minimizes path loss while enabling high data transfer rates in high-frequency bands like 5G and WiGig.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional antenna modules use separated antennas and chipsets connected via cables, then manufacturing is simpler, but path loss increases and antenna performance degrades in ultra-high frequency bands
Solution Approach 1:
The patent combines the antenna and chipset into a single integrated antenna module, eliminating the need for separate components and connecting cables. This integration reduces path loss by minimizing the transmission distance and removing cable interfaces, while the modular design maintains manufacturing feasibility through standardized substrate and housing structures.
2Reliability
If antenna and chipset are integrated in a single module, then path loss is reduced, but manufacturing breakdown occurs due to heterogeneous material adhesion
Solution Approach 1:
The patent introduces an adhesive substrate as an intermediary layer between the antenna substrate and chipset substrate. This adhesive substrate serves as a mediator that facilitates reliable bonding between heterogeneous materials, preventing manufacturing breakdown while maintaining the integrated design's performance benefits.
Solution Approach 2:
The patent employs composite material construction with distinct antenna and chipset substrates bonded through an adhesive substrate. This layered composite structure allows each component to be optimized for its specific function while the adhesive substrate ensures reliable integration, resolving the manufacturing challenges of heterogeneous material adhesion.
3Ease of manufacture
If base substrates of heterogeneous materials are adhered directly, then manufacturing is easier, but breakdown occurs during manufacturing
Solution Approach 1:
The adhesive substrate acts as an intermediary bonding layer that simplifies the manufacturing process by providing a standardized interface for adhering heterogeneous substrates. This mediator layer ensures consistent adhesion quality and prevents breakdown during manufacturing by distributing stresses and accommodating material mismatches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The antenna module effectively stacks heterogeneous materials to prevent breakdown, forms air gaps for reduced path loss, and enhances data transfer rates by increasing radio wave propagation distance, suitable for high-frequency communications.
Implementation Method 1
an adhesive substrate with air gap holes, allowing for the formation of air gaps between radiation patterns
Implementation Method 2
an antenna module that operates as an antenna by resonating in a few tens of GHz bands
Data Source
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AI summary
Disclosed is an antenna module for minimizing the occurrence of breakdowns during the manufacturing thereof by adhering heterogeneous material, which adheres heterogeneous material base substrates with adhesive substrates. The disclosed antenna module has a plurality of first radiation patterns formed on the upper surface of a first base substrate, has a plurality of second radiation patterns and a plurality of chipsets formed on the upper surface and the lower surface of a second base substrate disposed below the first base substrate, has a first adhesive substrate interposed between the first base substrate and the second base substrate, wherein the first adhesive substrate has air gap holes formed therein so as to form air gaps between the plurality of first radiation patterns and the plurality of second radiation patterns.