Wireless Antenna Module Layout for Bandwidth and Gain
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Solution Overview
Problem
Existing wireless communication systems face challenges in mitigating radio wave path loss and increasing transmission distance, particularly with the increasing use of multiple antennas, which require efficient spatial gain and cost-effective solutions to enhance communication performance.
Innovation Solution
A wireless communication module comprising a radiator and resonators on separate layers of substrates, where resonators are disposed in areas distinct from the radiator, enhancing bandwidth and gain through strategic placement and integration with RF components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple antennas are used to increase transmission distance and communication performance, then bandwidth and gain are improved, but device complexity and manufacturing cost increase due to additional FPCBs and pillars
Solution Approach 1:
The patent merges the radiator and resonators onto a single substrate, eliminating the need for separate FPCBs and pillars. The radiator is disposed on a first substrate while resonators are disposed on a second substrate that is integrated with the first substrate, consolidating multiple antenna components into one unified structure and reducing overall device complexity.
Solution Approach 2:
The substrate serves multiple functions by simultaneously supporting both the radiator and resonators. The first substrate acts as both the mounting platform for the radiator and provides structural support for the integrated second substrate containing resonators, reducing the need for additional support structures.
2Reliability
If multiple antennas are used to increase transmission distance and communication performance, then bandwidth and gain are improved, but manufacturing cost increases due to additional FPCBs and pillars
Solution Approach 1:
The patent merges the radiator and resonators onto a single substrate, eliminating the need for separate FPCBs and pillars. The radiator is disposed on a first substrate while resonators are disposed on a second substrate that is integrated with the first substrate, consolidating multiple antenna components into one unified structure and reducing overall device complexity.
3Area of stationary object
If resonators are disposed in the same area as the radiator, then spatial utilization is maximized, but signal interference and performance degradation occur
Solution Approach 1:
The patent segments the antenna system into distinct functional areas: the radiator is disposed on a first substrate while resonators are disposed on a second substrate. This spatial segmentation prevents signal interference between the radiator and resonators while maintaining efficient use of overall space through vertical integration.
Solution Approach 2:
The patent transitions from planar arrangement to three-dimensional stacking by disposing the resonators on a second substrate that is integrated with the first substrate. This vertical arrangement in another dimension allows both the radiator and resonators to coexist without spatial overlap, preventing signal interference while maximizing spatial utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves bandwidth and gain by expanding the frequency range and increasing signal intensity, addressing the limitations of existing systems while reducing the need for additional FPCBs and pillars, thus optimizing cost and performance.
Implementation Method 1
a plurality of resonators, a first substrate on which the radiator and the plurality of resonators are disposed
Data Source
AI summary
In various embodiments, a module for a wireless communication includes: a radiator, a plurality of resonators, a first substrate on which the radiator and the plurality of resonators are disposed, and a second substrate including a power supply. The first substrate includes a plurality of first layers. The second substrate includes a plurality of second layers. The radiator is disposed on a radiation layer of the plurality of first layers of the first substrate. The plurality of resonators is disposed on a resonance layer of the plurality of first layers of the first substrate. At least part of the plurality of resonators in the resonance layer is disposed in an area in the radiation layer, different from an area in which the radiator is disposed.


