Antenna Module Using Bonding Wires to Replace Coaxial Cables
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional antenna modules for millimeter wave communications face challenges such as limited layout space, restricted antenna shape flexibility, increased interference between antennas and ICs, and higher costs due to the use of coaxial cables for connecting integrated circuits and antennas.
Innovation Solution
The proposed antenna module incorporates a fan-out semiconductor package with an integrated circuit, encapsulant, core member, and connection member, along with an antenna package featuring directional antenna members, feed vias, and a dielectric layer, allowing for improved RF signal transmission and reception performance by securing antenna performance and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If coaxial cable connection is used to connect IC and antenna, then high frequency antenna performance is satisfied, but antenna layout space is limited and device size increases
Solution Approach 1:
The patent extracts the coaxial cable connection and replaces it with direct bonding wires, removing the intermediate component that occupied space. The antenna element is separated from the IC package and positioned on the PCB surface, freeing up layout space while maintaining electrical connection through alternative means (bonding wires instead of coaxial cables).
Solution Approach 2:
The patent introduces bonding wires as an intermediary connection method between the IC package and antenna element, replacing the coaxial cable. This intermediary solution maintains electrical connectivity while reducing spatial requirements and eliminating the need for cable management space.
2Reliability
If coaxial cable connection is used to connect IC and antenna, then high frequency antenna performance is satisfied, but degree of freedom of antenna shape is restricted
Solution Approach 1:
The patent removes the physical constraint of coaxial cable connection, allowing the antenna element to adopt various shapes and configurations. The antenna is extracted as a separate component that can be designed in different geometries (patches, dipoles, arrays) without being limited by cable routing requirements.
Solution Approach 2:
The patent enables dynamic design flexibility where the antenna shape and orientation can be optimized for different applications. The bonding wire connection allows the antenna to be positioned and shaped dynamically according to performance requirements rather than being constrained by rigid coaxial cable interfaces.
3Reliability
If coaxial cable connection is used to connect IC and antenna, then high frequency antenna performance is satisfied, but interference between antenna and IC increases
Solution Approach 1:
The patent extracts the antenna element from the immediate vicinity of the IC package by positioning it on the PCB surface, thereby reducing electromagnetic interference. The bonding wire connection provides a low-inductance path that minimizes interference compared to coaxial cable connections, which have higher inductance and radiation potential.
Solution Approach 2:
The patent replaces the mechanical coaxial cable connection system with an electrical bonding wire connection system. This substitution eliminates the mechanical interface and associated interference issues, providing a more integrated and interference-resistant connection method suitable for high-frequency operations.
4Reliability
If coaxial cable connection is used to connect IC and antenna, then high frequency antenna performance is satisfied, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive coaxial cables with inexpensive bonding wires for the connection between IC package and antenna. This substitution significantly reduces material costs while maintaining electrical performance. The bonding wire process is also more compatible with automated manufacturing, reducing labor and assembly costs.
Solution Approach 2:
The patent merges the antenna element directly with the PCB structure and integrates it with the IC package through bonding wires, eliminating the need for separate coaxial cable assembly. This integration reduces the number of components and assembly steps, thereby reducing manufacturing complexity and cost.
Data Source
AI summary
An antenna module includes a fan-out semiconductor package including an IC, an encapsulant encapsulating at least a portion of the IC, a core member having a first side surface facing the IC or the encapsulant, and a connection member including at least one wiring layer electrically connected to the IC and the core member and at least one insulating layer; and an antenna package including a plurality of first directional antenna members configured to transmit or receive a first RF signal. The fan-out semiconductor package further includes at least one second directional antenna member disposed on a second side surface of the core member opposing the first side surface of the core member, stood up from a position electrically connected to at least one wiring layer, and configured to transmit or receive a second RF signal.