Antenna Module With Chip Antenna On Connection Member
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Solution Overview
Problem
Millimeter wave (mmWave) communications, such as 5G, face significant signal loss due to absorption in high-frequency bands, leading to decreased communication quality, which existing antenna technologies struggle to address effectively.
Innovation Solution
An antenna module design featuring a patch antenna, an integrated circuit package, and a connection member with a laminated structure that includes a chip antenna with a dielectric body and electrodes, along with a flexible insulating layer, which reduces energy loss and provides additional layout space for improved omnidirectional RF signal transmission and reception.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If millimeter wave communications are used to support high data traffic, then communication capacity increases, but signal loss increases due to absorption in high-frequency bands
Solution Approach 1:
The patent combines a patch antenna and a chip antenna into a single antenna module. The patch antenna provides high gain for millimeter wave communication, while the chip antenna supplements signal transmission in directions where the patch antenna has low radiation efficiency, thereby reducing overall signal loss and improving communication capacity simultaneously
Solution Approach 2:
The antenna module serves multiple functions: the patch antenna handles primary millimeter wave communication, while the chip antenna provides supplementary transmission and reception in directions where the patch antenna is less effective. This multi-functional design allows the system to maintain high communication capacity across multiple directions and frequencies
2Adaptability or versatility
If a connection member with extended regions is used to accommodate chip antenna, then layout flexibility improves, but device complexity increases
Solution Approach 1:
The connection member is divided into a first region for mounting the patch antenna and a second region extending farther than the antenna package for mounting the chip antenna. This segmentation allows each region to serve its specific function independently, improving layout flexibility while managing complexity through functional separation
Solution Approach 2:
The connection member extends in a direction different from the lamination direction, utilizing spatial extension in another dimension. This allows the chip antenna to be positioned optimally for omnidirectional performance without increasing the footprint in the primary lamination plane, thereby improving layout flexibility without proportionally increasing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances remote transmission and reception efficiency by reducing energy loss and allowing for miniaturization, while maintaining high transmission efficiency across high-frequency bands, thus improving communication quality and avoiding external obstacles.
Implementation Method 1
a chip antenna disposed on the connection member and including a first electrode electrically connected to the IC, a dielectric body disposed on a surface of the first electrode, and a second electrode spaced apart from the first electrode and disposed on the dielectric body
Implementation Method 2
a connection member configured such that a portion of the connection member is disposed between the antenna package and the IC package, and having a laminated structure electrically connecting the patch antenna to the IC
Data Source
AI summary
An antenna module includes: an antenna package including a patch antenna; an integrated circuit (IC) package including an IC; a connection member configured such that a portion of the connection member is disposed between the antenna package and the IC package, and having a laminated structure electrically connecting the patch antenna to the IC; and a chip antenna disposed on the connection member and including a first electrode electrically connected to the IC, a dielectric body disposed on a surface of the first electrode, and a second electrode spaced apart from the first electrode and disposed on the dielectric body. The connection member includes a first region disposed between the antenna package and the IC package, and a second region extending farther than the antenna package in a direction different from a direction in which the connection member is laminated. The chip antenna is disposed in the second region.


