Antenna Module Connecting Element Design for Injection Molding Yield
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Solution Overview
Problem
Conventional antenna modules experience low manufacturing yields due to the melting and sealing off of soldering and adhesive areas during injection molding, resulting in imperfect contact or no signal, as these areas cannot withstand high temperatures and pressures.
Innovation Solution
An antenna module design featuring a connecting element with protruding first connecting portions that pass through a hole in the antenna, forming a propping portion for fixation, and a second connecting portion for electrical connection to the electronic element, allowing for secure attachment without relying on soldering or adhesive, which are susceptible to high temperatures and pressures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering or adhesive is used to electrically connect the antenna to the electronic element, then electrical connection is achieved, but the connection areas melt and seal off during injection molding due to high temperature and pressure, resulting in imperfect contact or no signal
Solution Approach 1:
The patent removes the soldering or adhesive connection areas from the antenna structure. Instead of using soldering or adhesive to electrically connect the antenna to the electronic element, the patent uses a cable assembly that passes through the antenna body, eliminating the vulnerable soldering/adhesive areas that cannot withstand injection molding conditions.
Solution Approach 2:
The patent introduces a cable assembly as an intermediary component to establish electrical connection between the antenna and electronic element. The cable assembly with its conductive core and insulation layer serves as a mediator that avoids the need for soldering or adhesive, thereby preventing melting and sealing off during injection molding.
2Ease of manufacture
If injection molding is used to package the antenna and electronic element, then protection is provided, but high temperature and pressure melt the soldering and adhesive areas, causing manufacturing defects
Solution Approach 1:
The patent extracts the vulnerable soldering and adhesive areas from the assembly before injection molding. By using a cable assembly that passes through the antenna body and connects to the electronic element without requiring soldering or adhesive, the patent eliminates the components that would melt and seal off during the injection molding process, thereby maintaining manufacturing yield.
3Strength
If the antenna is covered by plastic assembly via injection molding, then protection is achieved, but the soldering and adhesive areas are sealed off, resulting in imperfect contact
Solution Approach 1:
The patent removes the soldering and adhesive areas that would be sealed off by the plastic assembly. By using a cable assembly that passes through the antenna body, the electrical connection is maintained outside the sealed plastic enclosure, ensuring that the connection remains accessible and functional while still providing protection through the plastic assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively increases manufacturing yields by maintaining electrical connections and preventing the melting or sealing off of sensitive areas during injection molding, ensuring reliable antenna module assembly.
Implementation Method 1
bending the first connecting portion to form a first propping portion for fixing the first connecting portion in the first hole
Implementation Method 2
During injection molding, high temperature and high pressure are generated
Implementation Method 3
During injection molding, high temperature and high pressure are generated
Data Source
AI summary
An antenna module is disclosed, including an electronic element, an antenna and a connecting element. The antenna includes a hole. The connecting element includes a first connecting portion, a propping portion and a second connecting portion. The first connecting portion passes through the hole and is fixed to the antenna by the propping portion. The second connecting portion is electrically connected to the electronic element.


