Antenna Module Integrated into Electronic Device Cover
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Solution Overview
Problem
There is a need for an antenna module structure that can efficiently accommodate next-generation communication systems operating in super-high frequency bands, such as mmWave, within the increasingly compact spaces of electronic devices, while maintaining smooth communication and improving the device's grip feel.
Innovation Solution
An antenna module is integrated into the electronic device's cover, comprising an antenna array and a radio communication circuit, which reduces the space occupied inside the device and enhances the grip feeling by optimizing the arrangement of the antenna module within the device's narrower inner space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the antenna module is integrated into the cover, then the space occupied inside the device is reduced, but the manufacturing complexity increases
Solution Approach 1:
The antenna module is integrated with the cover to form a single unified structure, merging two previously separate components (antenna module and cover) into one. This integration reduces the overall volume occupied inside the device while consolidating manufacturing steps into a single molding process, thereby resolving the contradiction between space reduction and manufacturing complexity.
Solution Approach 2:
The cover is designed to serve multiple functions: it acts as both a protective cover and a housing for the antenna module. By making the cover multi-functional, the patent eliminates the need for separate antenna module housing, reducing internal space while maintaining manufacturing efficiency through a single component design.
2Length of moving object
If the antenna module is integrated into the cover, then the device becomes more compact, but the manufacturing process becomes more complex
Solution Approach 1:
The antenna module and cover are merged into a single integrated component through injection molding, reducing the overall device dimensions while consolidating multiple manufacturing steps into one efficient process, thereby resolving the contradiction between compactness and manufacturing ease.
Solution Approach 2:
The patent utilizes injection molding parameters and material selection to achieve integration of the antenna module with the cover. By optimizing molding parameters and selecting appropriate materials, the patent achieves compact device dimensions while maintaining ease of manufacture through a standardized molding process.
3Ease of operation
If the antenna module is integrated into the cover, then the grip feel is improved, but the structural complexity increases
Solution Approach 1:
The integration of the antenna module with the cover creates a unified external structure that improves grip feel by eliminating edges and discontinuities. The merged structure reduces the number of separate components and assembly interfaces, thereby improving ease of operation while actually reducing rather than increasing structural complexity.
Data Source
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AI summary
An electronic device having a space formed between a front face and a rear face thereof is provided. The electronic device includes a first cover disposed on the front face, a second cover disposed on the rear face, a frame surrounding a periphery of the first cover and a periphery of the second cover, at least one antenna module coupled to a first face of the second cover, and a printed circuit board disposed in the space and having a front face electrically connected to the at least one antenna module.