Antenna Module With Dielectric Layers For Millimeter Wave
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Solution Overview
Problem
Millimeter wave communications face challenges due to RF signal absorption in high frequency bands, leading to communication quality deterioration, requiring specialized antenna technologies for effective transmission and reception.
Innovation Solution
The antenna module design includes a ground layer, patch antenna pattern, coupling patch pattern, and dielectric layers with varying dielectric constants, along with electrical connection structures and a sub-substrate, to enhance antenna performance and reduce manufacturing costs while enabling efficient RF signal transmission and reception.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional antenna technology is used for high frequency bands, then manufacturing cost is reduced, but RF signal absorption increases and communication quality deteriorates
Solution Approach 1:
The patent changes the dielectric constant parameter by using a first dielectric layer with a first dielectric constant and a second dielectric layer with a second dielectric constant that is different from the first. This parameter variation optimizes RF signal transmission by minimizing absorption losses while maintaining manufacturing feasibility.
Solution Approach 2:
The patent employs composite dielectric structures with multiple layers having different dielectric constants. The first dielectric layer and second dielectric layer are positioned at different locations relative to the patch antenna and ground, creating a composite material system that reduces RF signal absorption and improves communication quality.
2Reliability
If dielectric layers with optimized dielectric constants are used, then antenna performance is improved, but device complexity increases
Solution Approach 1:
The patent segments the dielectric structure into multiple distinct layers - a first dielectric layer and a second dielectric layer - each with specific dielectric constants. This segmentation allows independent optimization of each layer's properties to enhance antenna performance while maintaining a manageable structural complexity through systematic arrangement.
Solution Approach 2:
The patent applies local quality by positioning dielectric layers with different dielectric constants at specific locations. The first dielectric layer is positioned between the patch antenna and ground, while the second dielectric layer is positioned at a different location, allowing each region to have optimized dielectric properties for its specific function.
3Volume of moving object
If miniaturization is achieved through integrated antenna-IC design, then device size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent merges the antenna structure with the IC substrate by integrating the patch antenna, dielectric layers, and ground structure into a unified planar configuration. This merging enables miniaturization of the overall device while using standardized PCB manufacturing processes to maintain reasonable precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves antenna performance by minimizing dielectric losses, reducing manufacturing costs, and enabling miniaturization, thus addressing the challenges of high-frequency signal absorption and quality deterioration in millimeter wave communications.
Implementation Method 1
a dielectric constant of at least a portion of a space between the patch antenna pattern and the ground layer may be smaller than a dielectric constant of the first dielectric layer and a dielectric constant of the second dielectric layer
Data Source
AI summary
An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.