Multilayer Antenna Module Layout for Thin Filter Integration

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Solution Overview

Problem

Existing antenna modules with built-in filters face challenges in reducing size and thickness while maintaining antenna and filter characteristics, as increasing the thickness of the dielectric substrate to improve antenna and filter performance contradicts the need for a compact design.

Innovation Solution

The antenna module incorporates a dielectric substrate with a multilayer structure, featuring a radiating element, feed wiring, and a filter, where the filter is positioned to not overlap with a recess on the substrate's surface, allowing for the accommodation of additional components like RFICs and maintaining necessary thickness for performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the thickness of the dielectric substrate is increased to improve antenna and filter characteristics, then antenna characteristics and filter characteristics are improved, but the size and thickness of the antenna module increases

Engineering Contradiction:
Improveantenna characteristics and filter characteristicsVSAvoidthickness of antenna module
Core Design Contradiction:
ReliabilityVSLength of moving object

Solution Approach 1:

The patent introduces a recess in the second main surface of the dielectric substrate, creating a localized third-dimensional space. This recess allows the filter to be positioned within the substrate thickness rather than requiring additional external space, thereby maintaining the necessary dielectric thickness for performance while reducing the overall antenna module thickness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The filter is nested within the dielectric substrate by positioning it in the recess formed in the second main surface. This nesting approach allows the filter to be accommodated within the substrate structure itself, eliminating the need to increase the overall module thickness while preserving the required dielectric thickness for optimal antenna and filter characteristics.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Length of moving object

If the thickness of the dielectric substrate is reduced to decrease the size of the antenna module, then the size and thickness of the antenna module are reduced, but antenna characteristics and filter characteristics deteriorate

Engineering Contradiction:
Improvethickness of antenna moduleVSAvoidantenna characteristics and filter characteristics
Core Design Contradiction:
Length of moving objectVSReliability

Solution Approach 1:

By creating a recess in the second main surface of the dielectric substrate, the patent utilizes the vertical dimension to accommodate the filter within the substrate thickness. This allows the overall module thickness to be reduced while maintaining sufficient dielectric thickness in the critical regions for optimal antenna and filter performance.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The recess creates a localized region within the dielectric substrate where the filter is positioned. This local structural modification allows different parts of the substrate to serve different functions: the recess area accommodates the filter while maintaining necessary thickness, and other areas maintain uniform thickness for optimal antenna characteristics, thus preserving overall performance while reducing module size.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11916312B2Antenna module, communication device mounting the same, and circuit board
Publication Date: 2024.02.27 MURATA MFG CO LTD
  • US11916312B2 patent drawing
  • US11916312B2 patent drawing
  • US11916312B2 patent drawing

AI summary

An antenna module includes a dielectric substrate having a multilayer structure, a radiating element, a feed wiring, a filter device, and a ground electrode. The dielectric substrate has a first main surface and a second main surface. The radiating element is formed on the first main surface of the dielectric substrate or in an inner layer than the first main surface. The feed wiring transmits a radio frequency signal to the radiating element. The filter device is arranged on the feed wiring. The ground electrode faces the radiating element and is arranged in a layer between the radiating element and the filter device. A recess is formed in the second main surface of the dielectric substrate. The filter device is arranged at a position that does not overlap with the recess when viewed in a plan view from a normal direction of the dielectric substrate.