Antenna Module With Glass Substrate And Multi-Dk Layers
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Solution Overview
Problem
Current Antenna-in-Package (AiP) systems using organic substrates face challenges in achieving fine-pitch designs and miniaturization due to process limitations and thick substrate thickness, leading to increased manufacturing costs and size constraints in wireless communication devices.
Innovation Solution
The use of a glass substrate with a low dielectric constant and a building-up layer structure, where a high-frequency antenna is disposed on a lower-dielectric-constant layer and a low-frequency antenna on a higher-dielectric-constant layer, allowing for independent frequency operation and reduced size through precise thickness control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an organic substrate is used in AiP system, then the manufacturing process is simpler, but fine-pitch design (less than 15/15 μm) cannot be achieved and substrate thickness is relatively thick
Solution Approach 1:
The patent changes the substrate material parameter from organic substrate to glass substrate, which has different physical and chemical properties. The glass substrate enables fine-pitch design (less than 15/15 μm) while maintaining manufacturing feasibility through controlled deposition processes, thus resolving the contradiction between ease of manufacture and manufacturing precision.
Solution Approach 2:
The patent employs a composite structure with multiple dielectric layers (first dielectric layer with first Dk, second dielectric layer with second Dk) on the glass substrate. This composite material approach allows optimization of both manufacturability and precision by combining materials with different properties, where each layer serves specific functional requirements for antenna performance and fabrication compatibility.
2Ease of manufacture
If an organic substrate is used in AiP system, then the manufacturing process is simpler, but substrate thickness is relatively thick which hinders miniaturization
Solution Approach 1:
The patent changes the substrate material from organic to glass, enabling precise thickness control through controlled deposition processes. The glass substrate can be manufactured with controlled thickness to reduce overall package size while maintaining structural integrity and electrical performance, thus resolving the contradiction between ease of manufacture and substrate thickness.
Solution Approach 2:
The patent introduces a multi-layer dielectric structure with different dielectric constants at different vertical positions. By controlling the thickness of each layer (first dielectric layer and second dielectric layer) and their respective Dk values, the patent optimizes the vertical dimension to achieve miniaturization while maintaining manufacturability through standard deposition techniques.
3Volume of stationary object
If high-frequency antenna and low-frequency antenna are disposed close together, then package size is reduced, but interference between antennas increases
Solution Approach 1:
The patent applies different dielectric properties to different local regions: the first dielectric layer with first Dk value is positioned near the low-frequency antenna, while the second dielectric layer with second Dk value is positioned near the high-frequency antenna. This local quality differentiation allows each antenna to operate in its optimized dielectric environment, reducing mutual interference while maintaining compact package size.
Solution Approach 2:
The patent changes the dielectric constant parameter in different spatial zones by using layers with different Dk values. This parameter variation with position allows the compact antenna structure to minimize interference effects, as each frequency band experiences optimized dielectric conditions in its immediate vicinity despite the close proximity of both antennas.
Data Source
AI summary
The present disclosure provides an antenna module. The antenna module includes a first layer, a second layer, a first antenna, and a second antenna. The first layer has a first dielectric constant. The second layer is adjacent to the first layer. The second layer has a second Dk lower than the first Dk. The first antenna is disposed on the first layer and is configured for operating at a first frequency. The second antenna is disposed on the second layer and is configured for operating at a second frequency higher than the first frequency.