Antenna Module Ground Pattern Segmentation for Bonding Strength
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Solution Overview
Problem
Conventional antenna modules face challenges in enhancing bonding strength to printed circuit boards without compromising circuit characteristics due to thermal stress and electromagnetic field leakage, particularly when increasing the size of solder balls to accommodate thermal expansion differences.
Innovation Solution
The antenna module incorporates a wiring layer between the circuit and antenna layers, with strategically positioned ground patterns and a signal terminal connected via pillar conductors, allowing for a larger clearance region that avoids overlapping with the filter circuit to reduce electromagnetic field leakage and parasitic capacitance, enabling the use of larger solder balls for enhanced bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the size of the solder ball is increased to enhance bonding strength, then bonding strength is improved, but the clearance region size must be increased which causes electromagnetic field leakage from the filter circuit
Solution Approach 1:
The ground pattern is segmented into multiple layers: a first ground pattern on the bottom surface of the circuit layer, a second ground pattern on the top surface, and a third ground pattern on the antenna layer. This segmentation allows the clearance region to be positioned between the first and second ground patterns without directly exposing the filter circuit to external electromagnetic fields, thus reducing electromagnetic field leakage while accommodating larger solder balls for enhanced bonding strength.
Solution Approach 2:
The ground shielding structure is extended from a single-plane configuration to a multi-layer three-dimensional configuration. By positioning ground patterns on both the top and bottom surfaces of the circuit layer and adding a third ground pattern on the antenna layer, the shielding effect is enhanced in the vertical dimension, effectively containing electromagnetic fields while allowing larger clearance regions for improved bonding.
2Strength
If the clearance region size is increased to accommodate larger solder balls, then bonding strength is improved, but parasitic capacitance increases due to overlap between ground pattern and signal terminal
Solution Approach 1:
The ground pattern is divided into multiple segments across different layers. The second ground pattern on the top surface of the circuit layer and the third ground pattern on the antenna layer are positioned to avoid overlapping with the signal terminal in the clearance region, thereby reducing parasitic capacitance while still providing adequate ground shielding for enhanced bonding strength.
Solution Approach 2:
By distributing ground patterns across multiple layers (bottom surface, top surface, and antenna layer), the invention reduces the overlap area between ground patterns and the signal terminal in any single plane. This multi-layer arrangement minimizes parasitic capacitance while maintaining sufficient ground coverage for bonding strength enhancement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses electromagnetic field leakage and reduces parasitic capacitance, allowing for increased signal terminal size and improved bonding strength to the printed circuit board without significantly affecting circuit characteristics.
Implementation Method 1
a first ground pattern provided on the surface of the circuit layer located on the opposite side of the wiring layer; a second ground pattern provided between the circuit layer and the wiring layer; a third ground pattern provided between the wiring layer and the antenna layer
Implementation Method 2
The signal terminal is connected to the filter circuit through a pillar conductor penetrating the circuit layer and the connection wiring
Implementation Method 3
The clearance region is formed at a position not overlapping the filter circuit as viewed in the lamination direction. The signal terminal is connected to the filter circuit through a pillar conductor penetrating the circuit layer and the connection wiring
Data Source
AI summary
Disclosed herein is an antenna module that includes a circuit layer having a filter circuit, an antenna layer having a radiation conductor, a wiring layer having a connection wiring, a first ground pattern provided on a surface of the circuit layer, a second ground pattern provided between the circuit layer and the wiring layer, a third ground pattern provided between the wiring layer and the antenna layer, and a signal terminal provided on the surface of the circuit layer where the first ground pattern is cut away. The clearance region is located so as not to overlap the filter circuit as viewed in a lamination direction. The signal terminal is connected to the filter circuit through a pillar conductor penetrating the circuit layer and the connection wiring. The radiation conductor receives power through a feed pattern connected to the filter circuit.