Antenna Module Ground Shielding for Millimeter Wave Isolation
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Solution Overview
Problem
Conventional antenna modules with integrated patch antennas and radio frequency circuit components suffer from deteriorated RF characteristics due to radio frequency signals propagating to signal terminals, particularly in millimeter wave bands, leading to signal interference and performance degradation.
Innovation Solution
The antenna module incorporates a dielectric substrate with patch antennas on one surface and a radio frequency circuit component on the opposite surface, featuring strategically positioned ground terminals that act as shields between the patch antennas and signal terminals to reduce signal interference, along with optimized feeder line design to minimize losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If patch antennas and radio frequency circuit component are integrated together in a compact antenna module, then device miniaturization and integration are achieved, but RF characteristics deteriorate due to radio frequency signals propagating to signal terminals
Solution Approach 1:
The antenna module is segmented into distinct functional zones: a first region for patch antennas and a second region for signal terminals, separated by a ground layer. This spatial segmentation prevents radio frequency signals from propagating to signal terminals while maintaining compact integration, thus resolving the contradiction between miniaturization and RF characteristic preservation.
Solution Approach 2:
A ground layer is introduced as an intermediary between the patch antennas and signal terminals. This ground layer acts as a shield that blocks radio frequency signals from reaching the signal terminals, enabling compact integration without compromising RF characteristics. The ground layer mediates the interaction between transmitting and receiving elements.
2Reliability
If ground layer is provided between patch antennas and signal terminals to shield radio frequency signals, then RF characteristics improve, but device complexity increases
Solution Approach 1:
The ground layer is merged with the dielectric substrate to form an integrated laminated structure. By combining the ground layer and substrate into a unified component, the shielding function is achieved without adding separate discrete parts, thus improving RF characteristics while minimizing increases in device complexity.
Solution Approach 2:
The ground layer serves multiple functions simultaneously: it provides electromagnetic shielding to improve RF characteristics, acts as a reference plane for impedance control, and contributes to the mechanical structure of the antenna module. This multi-functionality reduces the need for additional components.
3Adaptability or versatility
If feeder lines are made long to connect radio frequency circuit component and patch antennas, then flexibility in component placement is improved, but signal losses increase particularly in millimeter wave bands
Solution Approach 1:
The radio frequency circuit component is positioned in the thickness direction (third dimension) of the dielectric substrate rather than only in the planar direction. This vertical placement allows short feeder lines to connect the component with patch antennas while maintaining placement flexibility, thus reducing signal losses in millimeter wave bands without sacrificing adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances RF characteristics by reducing signal interference and improving isolation between patch antennas and signal terminals, resulting in improved performance and flexibility for millimeter wave applications.
Implementation Method 1
a ground terminal provided to a second main surface side of the dielectric substrate and set at a ground potential, wherein the ground terminal is arranged, when viewed from a direction perpendicular to the first main surface of the dielectric substrate, between the signal terminal and a first side surface of the dielectric substrate closest to the signal terminal in a polarizing direction of radio frequency signals to be emitted or received by the plurality of patch antennas
Data Source
AI summary
An antenna module (1) according to the present disclosure has a dielectric substrate (20), an array antenna (10) including a plurality of patch antennas (111), an RFIC (40) electrically connected to the plurality of patch antennas (111), a signal conductor post (131) electrically connected to the RFIC (40), and a ground conductor post (132) set at a ground potential. The ground conductor post (132) is arranged, when viewed from a direction perpendicular to a first main surface of the dielectric substrate (20), between the signal conductor post (131) and a first side surface closest to the signal conductor post (131) of the dielectric substrate (20) in a polarizing direction of radio frequency signals to be emitted or received by the plurality of patch antennas (111).