Antenna Module with High-Dk Dielectric Layer for Millimeter Wave
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Solution Overview
Problem
Conventional antenna modules for millimeter wave communications face challenges such as limited layout space, restricted antenna shape flexibility, increased interference between antennas and ICs, and higher costs due to their coaxial cable connections.
Innovation Solution
The antenna module incorporates a dielectric layer with a higher dielectric constant than the insulating layer, along with a connection member, feed vias, and a plating member to enhance RF signal transmission and reception performance while minimizing module size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a coaxial cable connection structure is used to connect IC and antenna on a board, then antenna performance (transmission and reception rate, gain, directivity) can be satisfied, but antenna layout space becomes insufficient and the degree of freedom of antenna shape is restricted
Solution Approach 1:
The patent extracts the antenna from the conventional board-mounted coaxial cable structure and repositions it within a cavity of the package case. This separation allows the antenna to be independently positioned and shaped within the cavity space, freeing it from the layout constraints of the board and enabling optimized antenna configurations for millimeter wave performance.
Solution Approach 2:
The patent transitions the antenna from a two-dimensional board surface layout to a three-dimensional cavity-based configuration. By utilizing the vertical and lateral dimensions within the package cavity, the antenna can achieve complex shapes and orientations that are not possible on a flat board, thereby improving performance while reducing layout space requirements.
2Reliability
If a coaxial cable connection structure is used to connect IC and antenna on a board, then antenna performance can be satisfied, but the degree of freedom of antenna shape is restricted
Solution Approach 1:
The antenna is extracted from the constrained board-mounted coaxial structure and placed in the package case cavity, where it can assume various shapes and configurations. This extraction grants design freedom to optimize the antenna shape for specific millimeter wave applications without being limited by board geometry or coaxial cable connection requirements.
Solution Approach 2:
The patent applies different structural characteristics to different parts of the antenna system. The antenna within the cavity can have optimized local geometries for millimeter wave radiation, while the connection structure to the IC uses standardized interfaces. This allows the antenna shape to be highly adaptable and optimized for performance without compromising connection reliability.
3Reliability
If a coaxial cable connection structure is used to connect IC and antenna on a board, then antenna performance can be satisfied, but interference between the antenna and the IC increases
Solution Approach 1:
The patent segments the antenna system from the IC by placing the antenna in a separate cavity space within the package case, rather than mounting both on the same board. This spatial segmentation reduces electromagnetic interference between the antenna and IC by increasing their physical separation and isolating their electromagnetic fields.
Solution Approach 2:
The patent introduces the package case cavity as an intermediary space between the IC and antenna. This cavity acts as an electromagnetic isolation zone that reduces direct interference between the IC and antenna while still allowing controlled signal transmission through feed vias and connection structures.
4Reliability
If a coaxial cable connection structure is used to connect IC and antenna on a board, then antenna performance can be satisfied, but the size and cost of the antenna module increases
Solution Approach 1:
The patent merges the antenna module with the package case structure, utilizing the cavity of the existing package case to house the antenna. This integration eliminates the need for separate antenna housings and mounting structures, thereby reducing the overall module size while maintaining antenna performance requirements.
Solution Approach 2:
The antenna is nested within the cavity of the package case, similar to a nested doll structure. The antenna, feed vias, and connection structures are all contained within the existing package case volume, maximizing space utilization and minimizing the overall module size while preserving antenna performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for miniaturization of the antenna module while improving RF signal transmission and reception performance, reducing transmission loss, and expanding bandwidth, thereby addressing the limitations of conventional designs.
Implementation Method 1
The dielectric layer has a dielectric constant Dk greater than a dielectric constant of at least one insulating layer
Implementation Method 2
one end of each feed via is electrically connected to a corresponding antenna member of the plurality of antenna members and another end of each feed via is electrically connected to a corresponding wire of the at least one wiring layer
Data Source
AI summary
An antenna module includes a connection member, an integrated circuit (IC), a dielectric layer, antenna members, feed vias, and a plating member. The connection member includes one or more wiring layer(s) and insulating layer(s). The IC is disposed on one surface of the connection member and is electrically connected to the wiring layer(s). The dielectric layer is disposed on another surface of the connection member. The antenna members are disposed in the dielectric layer, and the feed vias are disposed in the dielectric layer so that each has one end electrically connected to a corresponding antenna member and the other end electrically connected to a corresponding one of the wiring layer(s). The plating member is disposed in the dielectric layer to surround side surfaces of the feed vias. The dielectric layer has a dielectric constant Dk greater than that of at least one insulating layer.