Antenna Module with Integrated IC and Filter for mmWave
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Solution Overview
Problem
Current antenna modules for mmWave communications face challenges with high-frequency signal loss due to absorption, leading to reduced communication quality and increased size and cost, with limitations in antenna layout and increased interference between ICs and antennas.
Innovation Solution
An integrated antenna module structure that includes a connection member with wiring and insulating layers, an antenna package with multiple antenna members, an integrated circuit (IC) for frequency conversion, and a filter positioned outside the IC to reduce noise and eliminate the need for additional filters, allowing for miniaturization while maintaining high antenna performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an IC and antenna are disposed on a substrate and connected by a coaxial cable to meet high frequency performance requirements, then antenna performance (transmit/receive ratio, gain, directivity) is improved, but antenna layout space is insufficient, degree of freedom of antenna shape is limited, interference between antenna and IC increases, and size/cost of antenna modules increases
Solution Approach 1:
The patent integrates the IC and antenna into a single packaged structure, eliminating the need for separate coaxial cable connections. The IC is mounted on the back surface of the packaging substrate while the antenna is formed on the front surface, creating a compact integrated antenna module that improves space utilization and reduces interference while maintaining high-frequency performance
2Reliability
If an IC and antenna are disposed on a substrate and connected by a coaxial cable to meet high frequency performance requirements, then antenna performance (transmit/receive ratio, gain, directivity) is improved, but degree of freedom of antenna shape is limited
Solution Approach 1:
The integrated packaging structure allows the antenna to be formed directly on the packaging substrate with greater design flexibility. The antenna pattern can be optimized for specific frequency bands and performance requirements without being constrained by external cable connections, enabling diverse antenna shapes and configurations
3Reliability
If an IC and antenna are disposed on a substrate and connected by a coaxial cable to meet high frequency performance requirements, then antenna performance (transmit/receive ratio, gain, directivity) is improved, but interference between antenna and IC increases
Solution Approach 1:
The patent positions the IC on the back surface of the packaging substrate while the antenna is formed on the front surface, utilizing the third dimension (vertical separation) to spatially isolate the IC and antenna. This dimensional separation reduces electromagnetic interference while maintaining the integrated compact structure
4Reliability
If an IC and antenna are disposed on a substrate and connected by a coaxial cable to meet high frequency performance requirements, then antenna performance (transmit/receive ratio, gain, directivity) is improved, but size/cost of antenna modules increases
Solution Approach 1:
The patent creates a compact integrated antenna module where the IC and antenna are packaged together in a single substrate structure. This integration eliminates the need for separate coaxial cables and external connectors, significantly reducing the overall size and cost of the antenna module while maintaining high-frequency performance
Data Source
AI summary
An antenna module includes a connection member including at least one wiring layer and at least one insulating layer, an antenna package including a plurality of antenna members transmitting or receiving a radio frequency (RF) signal and a plurality of feed vias respectively electrically connected to the plurality of antenna members at one end and respectively electrically connected to a wiring corresponding to the at least one wiring layer at the other end, and positioned on a first surface of the connection member, an integrated circuit (IC) disposed on a second surface of the connection member and electrically connected to the wiring corresponding to the at least one wiring layer to receive an intermediate frequency (IF) signal or baseband signal and transfer an RF signal or receive an RF signal and transfer an IF signal or baseband signal, and a filter filtering an IF signal or a baseband signal.