Antenna Module Integrating Broadside and Edge Fire Arrays

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Solution Overview

Problem

Current antenna modules face challenges in achieving wide coverage and small size to support high-frequency signals for 5G communications, particularly in efficiently integrating broadside and edge fire antennas on a single substrate to enhance communication performance.

Innovation Solution

The antenna module integrates a broadside antenna array and an edge fire antenna array on the top and side surfaces of a dielectric substrate, respectively, using a conductive layer and dicing process to form the antennas, which reduces fabrication costs and increases coverage area without increasing the substrate size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If multiple antennas are integrated on a single substrate to achieve wide coverage, then coverage area is improved, but device size increases

Engineering Contradiction:
Improvecoverage areaVSAvoiddevice size
Core Design Contradiction:
Area of stationary objectVSVolume of moving object

Solution Approach 1:

The patent applies dimensionality change by forming antennas on multiple surfaces of the dielectric substrate - specifically the top surface and the side surface. This three-dimensional antenna integration allows the antenna module to achieve wide coverage area without increasing the planar footprint of the substrate, effectively resolving the contradiction between coverage area and device size.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If complex antenna integration processes are used to achieve dual radiation directions, then antenna performance is improved, but manufacturing complexity increases

Engineering Contradiction:
Improveantenna performanceVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the formation processes of multiple antennas by using a common conductive layer deposited on the dielectric substrate. This single conductive layer is subsequently patterned to create both the first antenna on the top surface and the second antenna on the side surface, thereby achieving dual radiation direction antennas while simplifying the manufacturing process and reducing production steps.

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If conventional antenna fabrication methods are used, then manufacturing process is simple, but fabrication cost increases

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidfabrication cost
Core Design Contradiction:
Ease of manufactureVSQuantity of substance

Solution Approach 1:

The conductive layer in the patent serves multiple functions simultaneously - it forms both the first antenna on the top surface and the second antenna on the side surface. This multi-functional use of a single conductive layer reduces the total amount of conductive material required and eliminates the need for separate antenna fabrication processes, thereby reducing overall fabrication costs while maintaining manufacturing simplicity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20230231305A1Antenna module and method for manufacturing the same
Publication Date: 2023.07.20 MEDIATEK INC
  • US20230231305A1 patent drawing
  • US20230231305A1 patent drawing
  • US20230231305A1 patent drawing

AI summary

An antenna module and a method for manufacturing an antenna module are provided. The antenna module includes a first dielectric substrate, a first antenna and a second antenna. The first dielectric substrate has a top surface, a bottom surface and a first side surface between the top surface and the bottom surface. The first antenna is formed on the top surface of the first dielectric substrate. The second antenna is formed on the first side surface of the first dielectric substrate.