High-Permittivity Antenna Module Layout for 5G mmWave Miniaturization
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Solution Overview
Problem
The challenge is to miniaturize antenna modules for electronic devices while maintaining high performance, as the increasing number of electronic components in devices like smartphones and foldable phones requires a reduction in antenna module size without compromising communication capabilities, especially for 5G millimeter wave communication.
Innovation Solution
The use of substrates with high permittivity materials to create a miniaturized antenna module with dual-polarized wave radiation capabilities, where multiple antennas are disposed on substrates with higher permittivity than the base substrate, allowing for efficient radiation in various directions and reducing the overall size of the module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple antennas are disposed on a general printed circuit board (PCB), then communication functions are provided, but the size of the antenna module cannot be decreased
Solution Approach 1:
The patent changes the permittivity parameter of the substrate material from standard PCB material to high permittivity material (e.g., ceramic substrate with permittivity of 7 or higher). This parameter change allows the antenna elements to be miniaturized while maintaining their radiation characteristics and communication functions, directly resolving the contradiction between providing multiple antenna functions and reducing module size.
Solution Approach 2:
The patent employs composite material structures by combining ceramic substrates (high permittivity) with metal antenna elements and protective coatings. This composite approach enables the antenna module to achieve both compact size and high-performance communication functions across multiple frequency bands, including 5G mmWave bands.
2Volume of moving object
If the antenna module size is reduced, then mounting space for other electronic components increases, but maintaining high performance becomes difficult
Solution Approach 1:
By changing the substrate permittivity parameter to high values (7 or higher), the patent achieves significant miniaturization of the antenna elements while maintaining their radiation efficiency and impedance characteristics. The high permittivity material concentrates the electromagnetic field, allowing compact antenna structures to maintain high performance in 5G mmWave communication.
Solution Approach 2:
The patent applies different material properties to different parts of the antenna module: high permittivity ceramic substrates for miniaturization, conductive metal layers for radiation elements, and protective coatings for environmental resistance. This local quality differentiation allows the compact module to maintain high communication performance across multiple frequency bands.
3Volume of moving object
If substrates with high permittivity materials are used, then antenna module size is miniaturized, but manufacturing complexity increases
Solution Approach 1:
The patent segments the antenna module into distinct functional layers: high permittivity ceramic substrate, metal antenna elements, and protective coating layers. This segmentation allows each layer to be manufactured and optimized separately using appropriate processes, then assembled into the final compact module, reducing overall manufacturing complexity despite using advanced materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables a compact antenna module that supports high-frequency bands, including 5G mmWave communication, by utilizing substrates with higher permittivity materials, enhancing communication performance and reducing space requirements within electronic devices.
Implementation Method 1
a second substrate disposed on the first surface of the first substrate and having a first antenna array and a second antenna array disposed on the second substrate, and a third substrate disposed in a portion of the second surface of the first substrate and having a third antenna array and a fourth antenna array disposed on the third substrate, wherein the second substrate and/or the third substrate is formed of a material having a higher permittivity than the first substrate
Data Source
AI summary
Disclosed is an electronic device including a housing, a wireless communication module, and an antenna module operatively connected to the wireless communication module and disposed inside the housing, wherein the antenna module includes a first substrate comprising at least one feed line, a first surface disposed in a first direction, and a second surface disposed in a second direction opposite the first surface, a second substrate disposed on the first surface of the first substrate and having a first antenna array and a second antenna array disposed on the second substrate, and a third substrate disposed in a portion of the second surface of the first substrate and having a third antenna array and a fourth antenna array disposed on the third substrate, wherein the second substrate and/or the third substrate is formed of a material having a higher permittivity than the first substrate.