Antenna Module Multi-Surface Front End Circuit Integration
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Solution Overview
Problem
5G communication systems face challenges with high attenuation characteristics and inefficient design rules for antenna modules, leading to reduced yield and increased costs due to misalignment and wasted elements in the manufacturing process.
Innovation Solution
An electronic device with a multi-front end integrated circuit configuration on a printed circuit board, where each front end integrated circuit is electrically connected through ports to support high-frequency communication, allowing for efficient signal transmission and reception across multiple frequency bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the PCB is designed with one front end integrated circuit according to design rules, then the vertical width is fixed and integration degree is enhanced, but the IC may be broken or misaligned causing reduced yield and increased cost
Solution Approach 1:
The patent divides the front end integrated circuit into multiple separate ICs (first front end integrated circuit and second front end integrated circuit) disposed on different surfaces of the PCB. This segmentation allows each IC to be independently positioned and connected through ports, eliminating the risk of breakage or misalignment associated with a single large IC while maintaining high integration degree.
2Device complexity
If one front end integrated circuit is designed with maximum number of antenna elements, then the antenna elements are integrated, but there are unused and wasted elements
Solution Approach 1:
The patent segments the antenna elements and front end integrated circuits into multiple groups. The first front end integrated circuit is connected to a first group of antenna elements, and the second front end integrated circuit is connected to a second group of antenna elements. This allows for optimized utilization of all antenna elements without waste, while maintaining high integration through port connections.
3Reliability
If multiple antenna elements are arranged in array pattern for beamforming, then the attenuation characteristic is enhanced, but the design complexity and manufacturing difficulty increase
Solution Approach 1:
The patent utilizes the third dimension by disposing front end integrated circuits on both the first surface and second surface of the PCB. This vertical stacking approach allows multiple antenna elements to be arranged in array pattern for beamforming while managing design complexity through standardized port connections between surfaces, reducing manufacturing difficulty.
Data Source
AI summary
In an antenna module on one printed circuit board, a first area where a plurality of antenna elements are positioned on a first surface, and a second area where a plurality of front end integrated circuits are independently positioned on a second surface, the opposite surface of the first surface, are provided, and a wire is provided in the second area to electrically couple some ports of a plurality of ports provided in a first front end integrated circuit to some ports of a plurality of ports provided in a second front end integrated circuit. The some ports provided in the first front end integrated circuit include a first port configured to output a first intermediate frequency signal, and a second port configured to input a second intermediate frequency signal.