Antenna Module With Embedded Chip And Nested Circuit Boards
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Solution Overview
Problem
The integration of more components in 5th generation wireless system antenna modules leads to increased size, which is problematic as devices are becoming smaller.
Innovation Solution
The antenna module design includes an inner circuit board with alternating inner dielectric and wiring layers, an antenna circuit board with exposed antenna structures, and an outer circuit board, allowing for compact integration of components while ensuring reliable electrical connections and high-frequency signal quality through specific layering and plating techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If more components are integrated in the antenna module for 5th generation wireless systems, then the functionality and performance are improved, but the size of the antenna module increases
Solution Approach 1:
The patent applies nesting by placing the antenna circuit board within a cavity of the inner circuit board, and embedding the chip within the outer circuit board. This nested arrangement allows multiple functional components to occupy overlapping or nested spatial volumes, enabling high component integration without proportionally increasing the overall module size.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by creating multiple layers (inner circuit board, antenna circuit board, outer circuit board) stacked vertically. The antenna circuit board is positioned in a cavity of the inner circuit board, and the chip is embedded in the outer circuit board, effectively using the vertical dimension to pack more components into a compact footprint.
2Volume of moving object
If components are integrated more compactly, then the size is reduced, but the reliability of electrical connections may deteriorate
Solution Approach 1:
The patent applies preliminary action by forming conductive vias and plating structures during the manufacturing process before final assembly. The inner pad is exposed from the dielectric layer in advance, and conductive vias are pre-formed to establish electrical pathways, ensuring reliable connections are built into the structure before components are mounted and connected.
Solution Approach 2:
The patent uses composite construction with multiple dielectric layers, conductive vias, and plating layers combined to create a multi-material structure. The inner circuit board comprises alternating dielectric and wiring layers, and the antenna circuit board integrates antenna structures with circuit board materials, creating robust composite assemblies that maintain connection reliability in compact form.
3Volume of moving object
If compact integration is achieved through layering techniques, then the size is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the antenna module into distinct functional boards: an inner circuit board with signal processing components, an antenna circuit board with antenna structures, and an outer circuit board with embedded chip. Each board is manufactured and prepared separately with specific features (exposed pads, conductive vias, cavities), then assembled together, which simplifies the overall manufacturing process compared to creating a single integrated structure.
Data Source
AI summary
An antenna module includes an inner circuit board, an antenna circuit board, an outer circuit board, and at least one chip. The inner circuit board includes at least one inner wiring layer and at least one inner dielectric layer. The antenna circuit board includes at least one antenna structure. The antenna circuit board and the outer circuit board are disposed on opposite sides of the inner circuit board. The inner wiring layer comprises at least one inner pad. At least one first opening passing through the outer circuit board is defined to expose the inner pad. Each chip is received in one first opening and electrically connects to the inner pad. The antenna structure electrically connects to the chip through the inner wiring layer. A method for manufacturing such antenna module is also provided.