Antenna Module Recess Embedding for 5G Thickness Reduction
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Solution Overview
Problem
The miniaturization of millimeter wave/5G antenna modules for mobile devices is limited by size and thickness constraints, making it difficult to secure a degree of freedom in mounting and reduce the number of processes while incorporating semiconductor chips and passive components.
Innovation Solution
The antenna module design features an antenna substrate with recess portions for mounting semiconductor chips and passive components, where the components are encapsulated and connected via redistribution layers, allowing for a reduced overall thickness and omission of connectors, enabling more flexible mounting and reduced thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor chips and passive components are mounted on the antenna substrate using conventional methods, then the antenna module can be assembled, but the thickness of the antenna module increases and the degree of freedom in mounting position is reduced
Solution Approach 1:
The passive component is nested within a recess portion of the antenna substrate, allowing it to be embedded rather than surface-mounted. This nesting approach reduces the overall thickness of the antenna module while accommodating both the semiconductor chip and passive component within the substrate volume, thereby improving adaptability for mounting in thin mobile devices.
Solution Approach 2:
The invention transitions from conventional surface-mounting (2D arrangement) to embedding components within the substrate thickness (utilizing the third dimension). By creating recess portions and embedding components vertically within the substrate, the design achieves reduced overall thickness while maintaining component functionality, enabling greater freedom in mounting positions within mobile devices.
2Reliability
If connectors are used to connect the semiconductor chip to the antenna substrate, then reliable electrical connection is achieved, but the number of processes increases and the thickness increases
Solution Approach 1:
The semiconductor chip is directly bonded to the antenna substrate without separate connectors, merging the connection function into the mounting process itself. This direct bonding approach eliminates the need for additional connector components and assembly steps, reducing overall complexity and thickness while maintaining reliable electrical connection through direct contact between chip pads and substrate traces.
Solution Approach 2:
The invention extracts and removes the connector component from the assembly, eliminating the intermediate connection element. By directly bonding the semiconductor chip to the antenna substrate, the design simplifies the structure by taking out the unnecessary connector, thereby reducing the number of assembly processes and overall module thickness while preserving electrical connection reliability.
Data Source
AI summary
An antenna module includes an antenna substrate including a core layer, insulating layers disposed on opposite surfaces of the core layer, and wiring layers including antenna patterns. The antenna substrate has first and second recess portions. The antenna module further includes a passive component disposed in the first recess portion, a semiconductor chip disposed in the second recess portion and having an active surface, an encapsulant encapsulating at least portions of the semiconductor chip and the passive component, and a connection portion disposed on the active surface of the semiconductor chip and including redistribution layers electrically connected to the semiconductor chip. The passive component has a thickness greater than that of the semiconductor chip, and the first recess portion has a depth greater than that of the second recess portion.