Antenna Module With Redistribution Layer Openings

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Solution Overview

Problem

In millimeter wave/5G antenna modules, there is a significant challenge in minimizing the mutual interference between semiconductor components, particularly in reducing the influence of the semiconductor package on the radiation patterns of the antenna, which is exacerbated by the need for miniaturization.

Innovation Solution

The antenna module design includes an antenna substrate with specific antenna patterns and feed patterns, and a semiconductor package with redistribution layers that are strategically positioned to minimize overlap with the antenna substrate, thereby reducing interference and maintaining radiation characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the semiconductor package is placed on the antenna substrate to achieve miniaturization, then the module size is reduced, but the radiation patterns of the antenna are significantly degraded due to mutual interference

Engineering Contradiction:

Improvemodule sizeVSAvoidradiation pattern degradation

Core Design Contradiction:

Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The antenna substrate is divided into a first region containing the antenna pattern and a second region containing the feed pattern. The semiconductor package is positioned to overlap only with the second region, spatially segmenting the antenna and package areas to minimize interference while maintaining compact form factor.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the antenna substrate are assigned different functions: the first region is optimized for radiation (antenna pattern) while the second region is optimized for feeding (feed pattern). The semiconductor package is strategically placed over the second region where it causes minimal disruption to the radiation characteristics.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If the feed pattern is disposed adjacent to the second surface to reduce interference, then the radiation patterns are improved, but the connection structure becomes more complex requiring redistribution layers

Engineering Contradiction:

Improveradiation pattern interferenceVSAvoidconnection structure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The feed pattern is positioned in the second region adjacent to the second surface of the antenna substrate, utilizing the vertical dimension and lateral positioning to separate the feed function from the radiation function. This spatial arrangement reduces mutual interference between the semiconductor package and antenna radiation while maintaining electrical connectivity through the substrate wiring layer.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS10903548B2Antenna module

Publication Date: 2021.01.26 SAMSUNG ELECTRONICS CO LTD

AI summary

An antenna module includes an antenna substrate having a first surface and a second surface disposed to oppose each other, and including a substrate wiring layer having a first antenna pattern positioned in a first region, a second antenna pattern disposed in a second region adjacent to one side, and first and second feed patterns connected to the first and second antenna patterns, respectively; and a semiconductor package including a connection structure disposed on the second surface except for an area overlapping with the second region of the antenna substrate and redistribution layers electrically connected to the substrate wiring layer, and at least one semiconductor chip having connection pads connected to the redistribution layers. A region overlapping with the second feed pattern in each of the plurality of redistribution layers is provided as an opened region.