Antenna Module Layout With Amplified Inter-Substrate RF Connection
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Solution Overview
Problem
Existing antenna module configurations face challenges in reducing size and thickness while maintaining antenna characteristics, particularly due to increased radio frequency signal attenuation and limited flexibility in arrangement, especially when the length of wiring portions is extended.
Innovation Solution
The proposed solution involves an antenna module with a first substrate for the radiating element, a second substrate for the feed circuit, and a connection member that includes an amplifier circuit to amplify radio frequency signals between the two substrates, allowing for increased flexibility in arrangement and reducing signal transmission loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the length of the wiring portion is increased to improve arrangement flexibility, then the degree of freedom in arrangement is improved, but radio frequency signal attenuation increases and antenna characteristics deteriorate
Solution Approach 1:
The connection member is divided into multiple layers, with the radiating element on a first substrate, the feed circuit on a second substrate, and intermediate substrates connecting them. This segmentation allows the wiring path to be distributed across multiple layers rather than requiring a single long wiring portion, reducing signal attenuation while maintaining arrangement flexibility.
Solution Approach 2:
The patent transitions from a planar two-dimensional arrangement to a three-dimensional multilayer structure. By utilizing vertical stacking of substrates and wiring portions across multiple layers, the feed circuit and radiating element can be positioned farther apart in the horizontal plane without increasing the electrical path length, thus improving arrangement freedom while controlling signal loss.
2Loss of energy
If the radiating element and feed circuit are disposed close to each other to reduce wiring length, then signal attenuation is reduced, but the degree of freedom in arrangement is limited
Solution Approach 1:
By utilizing the vertical dimension through multilayer substrate stacking, the feed circuit and radiating element can be separated in the horizontal plane to allow flexible arrangement while maintaining a short electrical connection path through the vertical layers, thus resolving the contradiction between arrangement freedom and signal attenuation.
Solution Approach 2:
Intermediate substrates are introduced as mediators between the feed circuit substrate and the radiating element substrate. These intermediate layers provide additional wiring paths and connection points that allow the feed circuit and radiating element to be positioned at different locations while maintaining efficient signal transmission through the multilayer structure.
3Adaptability or versatility
If the wiring portion is extended to allow separate placement of feed circuit and radiating element, then arrangement flexibility is improved, but manufacturing complexity increases
Solution Approach 1:
The complex wiring structure is segmented across multiple substrates and layers, with each layer containing simplified wiring patterns. This segmentation distributes the complexity across manageable sections rather than requiring a single complex wiring portion, making the overall structure easier to manufacture while maintaining arrangement flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the degree of freedom in arranging the antenna module while maintaining or improving antenna characteristics by reducing signal attenuation and allowing for separate placement of the feed circuit and radiating element, thus addressing the limitations of existing technologies.
Implementation Method 1
The amplifier circuit amplifies a radio frequency signal transmitted between the feed circuit and the radiating element
Data Source
AI summary
An antenna module includes a first substrate, a second substrate, a connection member connected between the first substrate and the second substrate, and an FEM disposed on the connection member. A radiating element is disposed on the first substrate. An RFIC for supplying a radio frequency signal to the radiating element is disposed on the second substrate. The connection member transmits radio frequency signals between the RFIC and the radiating element. The FEM amplifies radio frequency signals transmitted between the RFIC and the radiating element. The FEM is disposed at a position between a connecting point with the first substrate and a connecting point with the second substrate on the connection member.