Antenna Module with Segmented Cells for Millimeter Wave
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Solution Overview
Problem
Conventional antenna modules for millimeter wave communications face challenges such as limited layout space, restricted antenna shape flexibility, increased interference, and higher size and cost due to the integration of ICs and antennas with coaxial cables.
Innovation Solution
The design involves a connection member with wiring and insulating layers, where antenna cells with dielectric and plating members are independently manufactured and positioned on a separate surface, allowing for improved antenna performance and miniaturization by optimizing dielectric constants and radiation patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an IC and antenna are disposed on a board and connected by a coaxial cable, then high frequency antenna performance is satisfied, but antenna layout space is limited and the size of the antenna module increases
Solution Approach 1:
The antenna is divided into multiple independent antenna cells that can be disposed separately from the IC. Each antenna cell includes an antenna member, feed via, dielectric layer, and plating member, forming a modular structure that can be optimized independently from the IC layout.
Solution Approach 2:
The antenna cells are disposed on the back surface of the connection member, utilizing the third dimension (vertical stacking) rather than only the horizontal plane. This allows the antenna and IC to coexist without occupying the same layout space, effectively doubling the available antenna area.
2Reliability
If an IC and antenna are disposed on a board and connected by a coaxial cable, then high frequency antenna performance is satisfied, but the degree of freedom of antenna shape is restricted
Solution Approach 1:
The antenna is segmented into multiple independent antenna cells, each capable of having different shapes and configurations. This segmentation allows each cell to be optimized for specific radiation patterns and frequencies, providing greater overall shape flexibility.
Solution Approach 2:
Each antenna cell can have locally optimized properties including different dielectric constants, feed via configurations, and plating member designs. This allows different regions of the antenna system to have tailored characteristics for specific performance requirements.
3Reliability
If an IC and antenna are disposed on a board and connected by a coaxial cable, then high frequency antenna performance is satisfied, but interference between the antenna and IC increases
Solution Approach 1:
The antenna cells are extracted from the same plane as the IC and disposed on the back surface of the connection member. This physical separation removes the antenna from proximity to the IC, eliminating electromagnetic interference while maintaining high frequency performance.
Solution Approach 2:
The connection member with its insulating layer acts as an intermediary barrier between the IC and antenna cells. This intermediate structure provides electrical isolation and reduces coupling between the IC and antenna, minimizing interference.
4Reliability
If an IC and antenna are disposed on a board and connected by a coaxial cable, then high frequency antenna performance is satisfied, but the cost of the antenna module increases
Solution Approach 1:
The antenna cell components (antenna member, feed via, dielectric layer, plating member) are merged into a single integrated structure that can be manufactured as one unit. This integration reduces the number of separate components and assembly steps, lowering manufacturing cost.
Solution Approach 2:
The connection member serves multiple functions: it provides mechanical support for both the IC and antenna cells, provides electrical connection through wiring layers, provides electromagnetic isolation through insulating layers, and provides structural protection. This multi-functionality reduces the need for additional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables miniaturization of the antenna module while enhancing RF signal transmission and reception performance, reducing size and cost, and improving isolation and radiation patterns.
Implementation Method 1
a dielectric layer surrounding side surfaces of the feed via
Implementation Method 2
a plating member surrounding side surfaces of the dielectric layer
Implementation Method 3
an antenna member configured to transmit or receive a radio frequency (RF) signal
Data Source
AI summary
An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) disposed on a first surface of the connection member and electrically connected to the at least one wiring layer; and a plurality of antenna cells each disposed on a second surface of the connection member. Each of the plurality of antenna cells includes an antenna member configured to transmit or receive a radio frequency (RF) signal, a feed via having one end electrically connected to the antenna member and the other end electrically connected to a corresponding wire of the at least one wiring layer, a dielectric layer surrounding side surfaces of the feed via and having a height greater than that of the at least one insulating layer, and a plating member surrounding side surfaces of the dielectric layer.