Antenna Module Layout for Thin 5G Packaging With Separate Inductors
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Solution Overview
Problem
The challenge is to reduce the overall thickness of millimeter wave/5G antenna modules in mobile devices while maintaining the flexibility of mounting positions, as existing designs face limitations in size and thickness due to the inclusion of thick passive components like power inductors.
Innovation Solution
The proposed solution involves a semiconductor package with integrated semiconductor chips and passive components mounted on an antenna substrate, where a separate electronic component with greater thickness is surface-mounted separately from the semiconductor package, allowing for reduced overall module thickness and improved electromagnetic interference shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If passive components are integrated into the semiconductor package, then the package structure is simplified, but the overall thickness increases due to the thickness of passive components
Solution Approach 1:
The patent divides the module into two separate mounting areas: the semiconductor package (containing semiconductor chips and thin passive components) and the electronic component (containing thick passive components like power inductors). This segmentation allows each component to be optimized independently, with thick passive components mounted separately on the antenna substrate rather than being integrated into the semiconductor package, thereby reducing the overall module thickness while maintaining structural simplicity.
2Ease of manufacture
If thick passive components are mounted on the semiconductor package, then all components are integrated in one location, but the mounting position flexibility is reduced
Solution Approach 1:
The module separates component mounting into two distinct locations: the semiconductor package for active components and thin passive components, and the antenna substrate for thick passive components. This segmentation provides mounting position flexibility by allowing the electronic component to be positioned independently on the antenna substrate, enabling optimization of signal paths and electromagnetic characteristics without being constrained by the semiconductor package footprint.
Solution Approach 2:
The patent utilizes the available space on the antenna substrate in a different spatial arrangement, mounting thick passive components separately rather than vertically stacking them on the semiconductor package. This dimensional reorganization allows for optimized signal paths and electromagnetic performance while maintaining a compact overall form factor.
3Length of stationary object
If the overall module thickness is reduced, then spatial efficiency is improved, but the shielding capabilities may be compromised
Solution Approach 1:
The module separates electromagnetic shielding functions into two layers: the semiconductor package provides shielding for high-frequency signals at the chip level, while the electronic component mounted on the antenna substrate provides additional shielding and filtering for power and ground signals. This segmented shielding approach maintains effective EMI protection while minimizing overall module thickness.
Solution Approach 2:
The antenna substrate serves as an intermediary structure that enables both thin passive components to be connected to the semiconductor package and thick passive components to be mounted separately. This intermediary layer maintains proper signal paths and grounding while allowing the thick passive components to provide shielding without increasing the vertical thickness of the semiconductor package itself.
Data Source
AI summary
An antenna module includes an antenna substrate including an antenna pattern; a semiconductor package disposed on a lower surface of the antenna substrate, electrically connected to the antenna substrate, and having a semiconductor chip embedded therein; and an electronic component disposed at a side of the antenna substrate, electrically connected to the antenna substrate, and spaced apart from the semiconductor package by a predetermined distance. The antenna module includes a connection substrate connected to a portion of the antenna substrate, the connection substrate having an extension portion extending outward from the side of the antenna substrate, and the electronic component is disposed on the extension portion of the connection substrate to electrically connect to an inner wiring layer of the antenna substrate.