Antenna Module With Spaced Semiconductor Packages
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Solution Overview
Problem
Conventional antenna modules for mmWave communications, such as 5G, face challenges including limited antenna layout space, restricted antenna shape flexibility, increased interference between antennas and ICs, and higher costs due to the use of coaxial cables for connecting integrated circuits and antennas.
Innovation Solution
The proposed solution involves an antenna module where a first and second semiconductor package, each with redistribution layers, are mounted on an antenna substrate, allowing for a shorter signal path and greater flexibility in antenna design, with the packages spaced apart to reduce interference and enhance spatial efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If coaxial cables are used to connect IC and antenna on a board, then high frequency antenna performance is achieved, but antenna layout space is limited and device size increases
Solution Approach 1:
The patent merges the IC package and antenna into a single integrated structure where the antenna is formed directly on the package substrate. This eliminates the need for separate coaxial cable connections and reduces the overall space required, as the antenna and IC are co-located rather than separated by cable length
Solution Approach 2:
The package substrate serves as an intermediary element that simultaneously supports both the IC and the antenna structure. The substrate integrates the functions of mechanical support, electrical connection, and antenna radiation element, eliminating the need for separate coaxial cables while maintaining high-frequency performance
2Reliability
If coaxial cables are used to connect IC and antenna, then high frequency antenna performance is achieved, but antenna shape flexibility is restricted
Solution Approach 1:
The antenna design incorporates flexible routing patterns and adjustable geometric parameters that can be optimized for different shapes and configurations. The antenna structure can be dynamically adapted to various form factors while maintaining performance through integrated design on the package substrate
Solution Approach 2:
The antenna is segmented into multiple conductive elements or patches on the package substrate, allowing independent optimization of different portions. This segmentation enables flexible shaping and configuration adaptation while maintaining overall antenna performance through distributed current paths
3Reliability
If coaxial cables are used to connect IC and antenna, then high frequency antenna performance is achieved, but interference between antenna and IC increases
Solution Approach 1:
The harmful coaxial cable intermediary is extracted and removed from the system. By eliminating the cable connection, the source of interference is removed, and the IC and antenna are directly integrated on the same substrate with controlled impedance paths that minimize electromagnetic coupling and interference
4Reliability
If coaxial cables are used to connect IC and antenna, then high frequency antenna performance is achieved, but manufacturing cost increases
Solution Approach 1:
The manufacturing process merges the IC packaging and antenna fabrication into a single integrated process flow. The antenna pattern is formed directly on the package substrate using standard PCB trace techniques during the packaging process, eliminating the need for separate coaxial cable assembly steps and reducing overall manufacturing complexity and cost
Data Source
AI summary
An antenna module includes an antenna substrate, a first semiconductor package, disposed on the antenna substrate, including a first connection member including one or more first redistribution layers, electrically connected to the antenna substrate, and a first semiconductor chip disposed on the first connection member, and a second semiconductor package, disposed on the antenna substrate to be spaced apart from the first semiconductor package, including a second connection member including one or more second redistribution layers, electrically connected to the antenna substrate, and a second semiconductor chip disposed on the second connection member. The first semiconductor chip and the second semiconductor chip are different types of semiconductor chips.