Antenna Module With Stacked Chip And Patch Antennas
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Solution Overview
Problem
The development of 5G communication systems requires ultra-small antenna modules for millimeter wave communications, as conventional antennas are difficult to use due to the reduced wavelength, necessitating a compact design suitable for mobile communication terminals.
Innovation Solution
An antenna module comprising a substrate with a ground region and a feeder region, featuring chip antennas with a hexahedral body portion, radiation portion, and ground portion, where the radiation portion is separated from the ground region by a specific distance, and patch antennas disposed inside or on the substrate, optimized for gigahertz frequency bands to enhance wireless communication efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional antennas are used for 5G communication, then antenna performance can be maintained, but antenna size becomes too large for mobile terminals
Solution Approach 1:
The patent transitions from planar antenna designs to three-dimensional stacked configurations, placing multiple antenna elements (chip antennas and patch antennas) at different vertical layers. This dimensional change enables compact antenna integration while maintaining proper radiation patterns and reducing mutual interference through spatial separation.
Solution Approach 2:
The patent implements a nested antenna structure where chip antennas are mounted on the substrate surface and patch antennas are positioned within recesses or on opposite sides of the substrate. This nesting approach allows multiple antenna types to coexist in a compact volume, with each antenna type serving specific frequency bands without excessive size increase.
2Adaptability or versatility
If multiple antenna types are integrated to support multiple frequency bands, then communication versatility is improved, but device complexity increases
Solution Approach 1:
The patent designs a unified antenna module that simultaneously supports both sub-6 GHz and millimeter wave frequency bands. The chip antennas handle sub-6 GHz communications while patch antennas handle millimeter wave bands, with both types integrated into a single substrate structure that provides common grounding and feeding mechanisms, reducing overall system complexity.
Solution Approach 2:
The patent divides the antenna system into distinct functional segments: chip antennas for lower frequency bands and patch antennas for higher frequency bands. Each segment is optimized for its specific frequency range, allowing independent design and tuning while maintaining a unified integrated structure that simplifies overall system implementation.
3Volume of moving object
If chip antennas are mounted close to the ground region, then antenna size is reduced, but radiation efficiency decreases
Solution Approach 1:
The patent utilizes the vertical dimension to separate the chip antenna radiation portions from the ground region while maintaining compact horizontal footprint. By positioning radiation portions at specific heights above the ground plane and using via structures for grounding, the design achieves both compact size and adequate radiation efficiency through three-dimensional spatial arrangement.
Solution Approach 2:
The patent implements localized grounding structures and via placements specifically around the chip antenna radiation portions. The ground region is strategically positioned and sized to provide adequate grounding for radiation efficiency while minimizing the overall antenna module footprint. Localized via structures provide optimal grounding points without requiring extensive ground plane area.
Data Source
AI summary
An antenna module includes a substrate having a first surface including a ground region and a feeder region; chip antennas mounted on the first surface of the substrate; and at least one patch antenna disposed inside of the substrate or at least partially disposed on a second surface of the substrate. The chip antennas include a body portion, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion. The ground portion of each chip antenna is mounted on the ground region and the radiation portion of each chip antenna is mounted on the feeder region.