Antenna Module Step Design for Resin Spread Control
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Solution Overview
Problem
The existing methods for mounting antenna modules on substrates using binder resin result in variations in radiation characteristics due to uncontrollable thickness and spread of the resin, which can also decrease the fixing strength of the module, especially when the thickness is reduced.
Innovation Solution
The antenna module features a dielectric substrate with a conductor pattern, a high-frequency semiconductor device, and conductor columns embedded in a dielectric member, with a step in the side surface to control the upward spread of the binder resin and prevent it from reaching the top surface, ensuring consistent radiation characteristics and maintaining adhesion strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the multilayer module is reduced, then the area of the side surface to which the binder resin adheres is decreased, but the fixing strength of the multilayer module is decreased
Solution Approach 1:
The side surface of the multilayer module is segmented into two distinct regions: a first region with a greater area for binder resin adhesion, and a second region with a smaller area. This segmentation allows the module to maintain sufficient adhesion area for fixing strength while reducing the overall thickness of the module.
Solution Approach 2:
Different regions of the side surface are given different qualities in terms of area size. The first region has a greater area optimized for binder resin adhesion and fixing strength, while the second region has a smaller area. This local differentiation allows the module to achieve both reduced overall thickness and maintained fixing strength.
2Strength
If the binder resin adheres to the top surface of the multilayer module, then the height from the mounting substrate to the top of the mounting component may exceed an acceptable range, but the fixing strength is compromised
Solution Approach 1:
The side surface is segmented into a first region and a second region, where the binder resin is configured to adhere primarily to the first region with greater area. This segmentation prevents the binder resin from adhering to the top surface while maintaining sufficient adhesion area for fixing strength.
Solution Approach 2:
The binder resin adhesion is localized to specific regions of the side surface rather than allowing uniform adhesion across all surfaces. By confining adhesion to the first region with greater area on the side surface, the top surface remains free of binder resin, controlling the overall height while maintaining fixing strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses variations in radiation characteristics and maintains the adhesion strength of the antenna module by controlling the binder resin's spread and contact, even when the module thickness is reduced.
Implementation Method 1
The binder resin is injected into a gap between the multilayer module and the mounting substrate and also adheres to the side surfaces of the multilayer module
Data Source
AI summary
An antenna that is formed of a conductor pattern is disposed on a dielectric substrate. A high-frequency semiconductor device that supplies a high-frequency signal to the antenna is mounted on the bottom surface of the dielectric substrate. A plurality of conductor columns project from the bottom surface. The conductor columns are embedded in a dielectric member that is disposed on the bottom surface. An end of each of the conductor columns is exposed through the dielectric member. The dielectric member defines a mounting surface that faces a mounting substrate. A step is formed in a side surface of a composite structure that includes the dielectric substrate and the dielectric member, and a side surface extending from the mounting surface to the step is more recessed than a side surface that is located above the step.