Millimeter-Wave Antenna Module With Integrated Thermal and Coaxial Feed
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Solution Overview
Problem
5G millimeter wave antenna modules face efficiency losses due to heat issues and electromagnetic interference (EMI) noise, requiring improved heat dissipation and impedance matching.
Innovation Solution
The antenna module incorporates a heat dissipation structure with thermal interface material (TIM), a heat sink, and a fan to manage heat, along with a coaxial line structure for power feeding and grounding via electrodes to enhance impedance matching and isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat dissipation structure (TIM, heat sink, fan) is added to the antenna module, then heat generation is suppressed and antenna efficiency is improved, but device complexity increases
Solution Approach 1:
The patent combines the RF chipset and heat dissipation structure into an integrated unit. The TIM is disposed on the rear surface of the RF chipset, and the heat sink is coupled to the TIM, forming a unified thermal management system that improves antenna efficiency while managing complexity through integration rather than separate components.
Solution Approach 2:
The RF chipset serves dual functions: signal processing and heat generation that requires dissipation. The heat dissipation structure (TIM and heat sink) is designed to work specifically with the RF chipset, creating a multi-functional assembly that addresses both electrical performance and thermal management in a single integrated solution.
2Manufacturing precision
If coaxial line structure with power feeding via electrode and grounding via electrode is implemented, then impedance matching is improved, but device complexity increases
Solution Approach 1:
The grounding via electrode is disposed to surround at least a portion of the side surface of the power feeding via electrode, creating a nested coaxial structure. The grounding electrode acts as an outer conductor while the power feeding electrode serves as the inner conductor, forming a compact nested arrangement that achieves superior impedance matching through the coaxial geometry.
3Object-generated harmful factors
If grounding via electrode surrounds power feeding via electrode in coaxial structure, then isolation between power feeding circuits is improved, but manufacturing precision requirements increase
Solution Approach 1:
The grounding via electrode completely surrounds the power feeding via electrode in a concentric arrangement, creating a Faraday cage effect that shields the inner power feeding conductor from electromagnetic interference. This nested configuration provides inherent EMI protection while the coaxial symmetry reduces sensitivity to manufacturing tolerances compared to offset arrangements.
Solution Approach 2:
The patent converts the potential harmful effect of EMI noise into a beneficial shielding effect by using the grounding via electrode as an outer conductor that actively protects the inner power feeding electrode. The grounding structure that adds complexity also provides the benefit of EMI suppression through electromagnetic shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses heat generation, improves antenna characteristics and efficiency in the 5G millimeter wave band, and enhances impedance matching and isolation between power feeding circuits.
Implementation Method 1
a thermal interface material (TIM) disposed at one side of the RF chipset to transfer heat generated from the RF chipset
Implementation Method 2
a heat sink disposed at one side of the TIM to spread heat transferred from the TIM
Implementation Method 3
a fan disposed at one side of the heat sink to cool the heat sink by introducing outside air
Data Source
AI summary
An antenna module is provided. An antenna module includes a radiation pattern that functions as an antenna; a base layer disposed on one side of the radiation pattern and implemented by stacking a plurality of low-temperature co-fired ceramic (LTCC) substrates to have a connection pattern electrically connected to the radiation pattern; an RF chipset electrically connected to the radiation pattern through the connection pattern to generate an RF signal to be transmitted from the radiation pattern or to process an RF signal received from the antenna; a thermal interface material (TIM) disposed at one side of the RF chipset to transfer heat generated from the RF chipset; a heat sink disposed at one side of the TIM to spread heat transferred from the TIM; and a fan disposed at one side of the heat sink to cool the heat sink by introducing outside air.