Antenna Module Via Routing for Multiband Isolation
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Solution Overview
Problem
The increasing communication traffic and demand for higher speeds in wireless networks, particularly with the advent of 5G, pose challenges in maintaining communication quality and speed due to interference between signal transmission paths in multiband antenna modules.
Innovation Solution
The antenna module design incorporates two power feeding elements with different resonant frequencies, where the power feeding wiring for the high-frequency side includes a via that rises to the power feeding element at a position different from the power feeding point, and a wiring pattern connects the via to the power feeding point, reducing coupling between signal transmission paths and improving isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple power feeding elements are used for multiband communication, then communication speed and quality improve, but isolation between signal transmission paths deteriorates
Solution Approach 1:
The patent transitions from planar wiring to three-dimensional wiring by introducing vias that extend vertically through the substrate. The second power feeding wiring uses a via to reach the second power feeding element from a different layer, creating spatial separation in the vertical dimension. This dimensional change reduces electromagnetic coupling between the first and second power feeding elements, improving isolation while maintaining multiband communication capability.
Solution Approach 2:
The via structure acts as an intermediary element that connects different layers of the substrate. By introducing this intermediate vertical connection structure, the patent enables the second power feeding wiring to reach the second power feeding element without directly crossing or adjacent to the first power feeding element in the horizontal plane, thereby reducing interference while maintaining electrical connection.
2Ease of manufacture
If power feeding wiring directly connects to power feeding point, then electrical connection is simplified, but coupling between signal transmission paths increases
Solution Approach 1:
The patent introduces a via structure that extends the second power feeding wiring into the vertical dimension. Instead of a direct planar connection, the wiring now travels through multiple layers via the via, achieving spatial separation from the first power feeding element. This maintains electrical connection functionality while reducing electromagnetic coupling through three-dimensional routing.
3Length of stationary object
If via position is at the power feeding point, then wiring length is minimized, but isolation between frequency bands deteriorates
Solution Approach 1:
The patent deliberately creates an asymmetric configuration where the via position does not coincide with the second power feeding point. The second power feeding wiring connects to the via at one location and then extends to the power feeding point at a different location, creating an offset configuration. This asymmetric arrangement breaks the direct alignment that would cause coupling, improving isolation between frequency bands while accepting a slightly longer wiring path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient transmission and reception of radio frequency signals in multiple frequency bands while enhancing isolation between signal paths, leading to improved communication quality and speed.
Implementation Method 1
the second power feeding wiring includes a first via that rises from the ground electrode side to the second power feeding element at a position different from the second power feeding point when the dielectric substrate is seen in a plan view, and a first wiring pattern that connects the first via and the second power feeding point
Data Source
AI summary
An antenna module includes a dielectric substrate, a ground electrode, a power feeding element (121) and a power feeding element (122) each facing the ground electrode, and power feeding wirings (141) and (142). The power feeding wiring (141) transmits a radio frequency signal to a power feeding point (SP1) of the power feeding element (121). The power feeding wiring (142) transmits a radio frequency signal to a power feeding point (SP2) of the power feeding element (122). A frequency of a radio wave from the power feeding element (122) is higher than a frequency of a radio wave from the power feeding element (121). The power feeding wiring (142) includes a via rises from the ground electrode side to the power feeding element (122) at a position different from the power feeding point (SP2) and a wiring pattern that connects the via and the power feeding point (SP2).