Antenna Modules With Segmented Boards For Millimeter Wave Arrays
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Solution Overview
Problem
Conventional antenna arrays for millimeter wave applications require complex circuit boards with multiple layers, which are expensive, have low yield, and are difficult to test, and lack balanced metal density and dielectric thickness, making them unsuitable for compact, cost-effective, and thermally efficient designs.
Innovation Solution
The development of antenna modules comprising a compact antenna board with integrated circuit packages that can be separately fabricated and assembled, allowing for improved design flexibility, reduced warpage, ease of assembly, and enhanced thermal performance, while enabling the use of different antennas and IC packages within a single module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional antenna arrays use complex multi-layer circuit boards, then antenna performance can be achieved, but manufacturing cost increases, yield decreases, and testing difficulty increases
Solution Approach 1:
The antenna array is divided into multiple independent antenna units, each fabricated separately on simple circuit boards and then assembled into the final array. This segmentation allows each unit to be manufactured independently with higher yield and lower cost, while maintaining the overall antenna performance through proper arrangement and phasing of the individual units.
2Reliability
If conventional antenna arrays use multi-layer circuit boards, then antenna performance can be achieved, but testing difficulty increases
Solution Approach 1:
By dividing the antenna array into separate, independently testable units with simpler circuit board structures, each unit can be tested individually before assembly. This significantly reduces testing complexity compared to testing a fully integrated multi-layer board, as defects can be isolated to specific units rather than requiring comprehensive testing of the entire complex structure.
3Reliability
If conventional antenna arrays use multi-layer circuit boards, then antenna performance can be achieved, but metal density and dielectric thickness become unbalanced
Solution Approach 1:
Each antenna unit is fabricated on a separate circuit board with optimized metal density and dielectric thickness for that specific unit's requirements. This allows independent optimization of electrical characteristics for each unit without being constrained by the need to maintain balanced metal and dielectric distribution across a complex multi-layer board structure, thereby improving manufacturing precision.
4Volume of moving object
If compact antenna modules are designed, then device size decreases, but thermal management becomes more challenging
Solution Approach 1:
The antenna units are arranged in a three-dimensional configuration with vertical stacking and spatial distribution, creating multiple dimensions for heat dissipation pathways. This dimensional arrangement allows heat to be conducted away from IC packages through multiple routes including lateral spreading across the circuit board and vertical conduction through stacked layers, effectively managing thermal loads in compact form factors.
Data Source
AI summary
Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.