Antenna Mounting Structure With Insulation Layer Against Conductor Peeling
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Solution Overview
Problem
The existing antenna installation structures face issues with peeling off of the antenna conductor due to significant differences in linear expansion coefficients between the double-sided tape and the antenna substrate, leading to stress application and potential detachment of the antenna conductor from the dielectric substrate.
Innovation Solution
An antenna installation structure is designed with an insulation layer having a linear expansion coefficient closer to that of the antenna substrate than the bonding material, which is placed between the antenna substrate and the bonding material, reducing the stress difference and preventing peeling off of the antenna conductor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a double-sided tape is used for fixing the antenna substrate, then ease of installation is improved, but reliability deteriorates due to peeling off of the antenna conductor
Solution Approach 1:
The patent introduces an intermediate layer between the antenna substrate and the double-sided tape. This intermediate layer has a linear expansion coefficient that is closer to that of the antenna substrate than the double-sided tape, thereby reducing thermal stress and preventing peeling off of the antenna conductor while still allowing easy installation using the double-sided tape.
Solution Approach 2:
The patent changes the physical parameter (linear expansion coefficient) of the material used in the intermediate layer to match more closely with the antenna substrate. By selecting a material whose linear expansion coefficient is between that of the antenna substrate and the double-sided tape, the thermal stress is reduced, preventing conductor peeling while maintaining installation ease.
2Ease of manufacture
If a double-sided tape is used for fixing the antenna substrate, then ease of temporary fixing is improved, but manufacturing precision deteriorates due to stress application on the antenna conductor
Solution Approach 1:
The intermediate layer acts as a mediator that reduces the direct contact between the high-stress double-sided tape and the antenna substrate. This intermediate layer with matched linear expansion coefficient minimizes stress transmission, thereby maintaining manufacturing precision while preserving the ease of temporary fixing benefit.
Solution Approach 2:
By changing the material parameter (linear expansion coefficient) of the intermediate layer to be closer to that of the antenna substrate, the stress applied during curing is reduced. This prevents deformation or displacement of the antenna conductor, maintaining manufacturing precision while allowing easy temporary fixing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces or prevents peeling off of the antenna conductor, enhancing the reliability of the antenna installation structure by minimizing stress and maintaining antenna characteristics.
Implementation Method 1
The linear expansion coefficient of the insulation layer is less than the linear expansion coefficient of the bonding material and higher than the linear expansion coefficient of the antenna substrate
Data Source
AI summary
An antenna installation structure includes an antenna substrate, an insulation layer, and a bonding material. The antenna substrate includes a dielectric base including first and second main surfaces, and an antenna conductor on the first main surface. The insulation layer is on the first main surface of the antenna substrate. The bonding material is between the insulation layer and a radiation side wall of a housing, is cured, and bonds the insulation layer to the radiation side wall. A linear expansion coefficient of the insulation layer is lower than a linear expansion coefficient of the bonding material and higher than a linear expansion coefficient of the antenna substrate.