Antenna Apparatus with Nested Conductive Rings for Millimeter Wave Signal Concentration
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Solution Overview
Problem
High-frequency millimeter wave communications, such as 5G, face challenges in maintaining communication quality due to signal absorption, requiring innovative antenna designs that differ from conventional technology to enhance gain and reduce phase distortion and signal leakage.
Innovation Solution
The antenna apparatus and module incorporate a patch antenna pattern with conductive ring patterns and chain vias, where the second through region is larger than the first, and a coupling patch pattern, to concentrate RF signals in the Z direction, improving gain and reducing phase distortion and signal leakage without increasing size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional antenna designs are used for high-frequency millimeter wave communications, then device complexity is reduced, but signal absorption and loss increase dramatically
Solution Approach 1:
The antenna structure is divided into multiple functional layers including a ground layer with through-holes, multiple conductive ring patterns at different heights, chain vias for electrical connection, and a coupling patch pattern. This segmentation allows each layer to perform specific functions that collectively reduce signal absorption and loss in high-frequency millimeter wave communications
Solution Approach 2:
The patent transitions from a conventional planar antenna design to a three-dimensional multi-layer structure. Conductive ring patterns are positioned at different heights (first conductive ring pattern lower, second conductive ring pattern higher), and chain vias connect these layers vertically, creating a volumetric structure that improves signal concentration and reduces loss without increasing footprint area
2Reliability
If antenna gain is increased to compensate for signal absorption, then communication quality improves, but device size increases
Solution Approach 1:
The first conductive ring pattern is positioned within the lateral boundaries of the second conductive ring pattern, creating a nested configuration. This nested structure allows multiple functional elements to occupy overlapping spatial volumes, increasing antenna gain and signal concentration without proportionally increasing the overall footprint area
Solution Approach 2:
The patent varies the area parameters of different through regions: the first through region area is smaller, the second through region area is larger, and the third through region area is intermediate. This parameter variation optimizes signal concentration and phase distortion reduction while maintaining a compact overall structure
3Reliability
If phase distortion and signal leakage are reduced, then communication reliability improves, but manufacturing complexity increases
Solution Approach 1:
The conductive ring patterns serve multiple functions simultaneously: they provide electrical connection through chain vias, create capacitive coupling between layers, define through regions for signal concentration, and provide mechanical support structure. This multi-functionality reduces the need for separate components, simplifying manufacturing while improving phase distortion and signal leakage control
Solution Approach 2:
The grounding vias electrically connect the first conductive ring pattern and the ground layer into a unified grounding system. This merging of grounding functions into a single integrated structure simplifies the manufacturing process while effectively reducing signal leakage and improving phase consistency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances antenna performance by concentrating RF signals, reducing phase distortion, and minimizing signal leakage, thereby improving communication quality in high-frequency bands without the need for additional components or size increases.
Implementation Method 1
a first conductive ring pattern laterally spaced apart from the patch antenna pattern, and having a first through region laterally surrounding the patch antenna pattern; and a second conductive ring pattern disposed in a position vertically higher than a position of the first conductive ring pattern, and having a second through region laterally surrounding the patch antenna pattern
Implementation Method 2
an area of the second through region is greater than an area of the first through region
Implementation Method 3
a grounding via disposed to electrically connect the first conductive ring pattern and the ground layer to each other
Data Source
AI summary
An antenna apparatus includes: a feed via; a patch antenna pattern electrically connected to one end of the feed via; a ground layer disposed in a position vertically lower than a position of the patch antenna pattern, and having a through-hole through which the feed via passes; a first conductive ring pattern laterally spaced apart from the patch antenna pattern, and having a first through region laterally surrounding the patch antenna pattern; and a second conductive ring pattern disposed in a position vertically higher than a position of the first conductive ring pattern, and having a second through region laterally surrounding the patch antenna pattern, wherein an area of the second through region is greater than an area of the first through region.