Antenna Device With Overlapping Substrates For Miniaturization

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Solution Overview

Problem

Existing phased array antennas are large in size, hindering miniaturization and efficient application.

Innovation Solution

The antenna device incorporates a design with overlapping substrates forming a phase shift region, where first pads on a step protruding from the phase shift region receive drive signals through connection lines, reducing the size of the antenna unit and enabling miniaturization by eliminating the need for wider steps to support flexible printed circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional phased array antenna design is used with wide steps to support flexible printed circuits, then connection reliability is improved, but antenna size increases

Engineering Contradiction:
Improveconnection reliabilityVSAvoidantenna size
Core Design Contradiction:
ReliabilityVSVolume of moving object

Solution Approach 1:

The patent transitions from a planar layout to a three-dimensional stacked configuration. Multiple antenna units are arranged in layers with overlapping substrates, allowing connection pads to be positioned vertically above each other rather than horizontally adjacent. This vertical arrangement reduces the horizontal footprint while maintaining connection reliability through the stepped substrate structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a nested configuration where antenna units are stacked in multiple layers with smaller components positioned within the footprint of larger ones. The substrates overlap in a nested manner, with connection regions arranged concentrically or in nested patterns, allowing multiple antenna elements to share the same spatial envelope and reducing overall antenna size.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Volume of moving object

If antenna units are arranged in a compact stacked configuration, then antenna size is reduced, but manufacturing complexity increases

Engineering Contradiction:
Improveantenna sizeVSAvoidmanufacturing complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent divides the antenna system into modular antenna units, each comprising a substrate with integrated connection pads and antenna elements. These standardized modules can be manufactured independently using conventional PCB techniques, then assembled into compact stacked configurations. The segmentation allows complex three-dimensional arrangements to be built from simple, manufacturable building blocks.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent designs universal substrate structures that serve multiple functions: providing mechanical support, establishing electrical connections, and defining antenna element positions. The stepped substrate configuration and pad arrangements are designed to be compatible with standard manufacturing processes while enabling compact three-dimensional integration, reducing the need for specialized manufacturing equipment or techniques.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20220224006A1Antenna device
Publication Date: 2022.07.14 SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
  • US20220224006A1 patent drawing
  • US20220224006A1 patent drawing
  • US20220224006A1 patent drawing

AI summary

Provided is an antenna device. The antenna device includes at least one antenna unit and first connection lines, where each antenna unit includes a first substrate and a second substrate, a region where the first substrate and the second substrate overlap forms a phase shift region in a thickness direction of the first substrate; the second substrate includes a first step protruding from the phase shift region in a first direction, a side of the first step close to the first substrate is provided with multiple first pads arranged in a second direction, the first pads are disposed on a side of the second substrate close to the first substrate, and the first direction intersects the second direction; and the first pads are connected to the first connection lines, and the first pads receive a drive signal output by an external driver circuit through the first connection lines.