3D Antenna Package Air Cavity for High-Gain Millimeter Wave Signals
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Solution Overview
Problem
Semiconductor device packages utilizing antennas for signal transmission face challenges with increased package size due to the use of thick substrates and antenna arrays, which are necessary for 5G and millimeter wave communications.
Innovation Solution
The semiconductor device package incorporates a first and second antenna pattern at different elevations defining an air cavity, with a curved antenna array and a circuit layer, allowing for reduced size and increased antenna gain through resonant cavities and multi-band radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If a thick substrate and antenna array are used for 5G and millimeter wave communications, then antenna gain and signal transmission capability are improved, but package size increases
Solution Approach 1:
The patent transitions from a planar antenna layout to a three-dimensional configuration by positioning antenna elements at different elevations (first and second antenna patterns at different heights). This vertical dimensionality change allows the antenna array to achieve higher gain and better signal transmission capability without proportionally increasing the horizontal package footprint, effectively resolving the contradiction between antenna performance and package size.
Solution Approach 2:
The patent embeds multiple antenna patterns within a compact vertical space, with the first and second antenna patterns nested at different elevations above the substrate. This nesting approach allows multiple antenna elements to occupy a smaller overall volume while maintaining the necessary spacing for effective millimeter wave transmission, thus improving antenna gain without significantly increasing package size.
2Adaptability or versatility
If multiple antenna units are arranged in an antenna array, then multi-band radiation capability is improved, but device complexity increases
Solution Approach 1:
The patent designs the antenna array such that multiple antenna units serve dual purposes: each unit contributes to both single-frequency operation and multi-band radiation capability. The first and second antenna patterns can operate independently at different frequencies or work together for multi-band coverage, reducing the need for separate dedicated antenna elements for each frequency band, thereby lowering overall device complexity while maintaining versatility.
Solution Approach 2:
The antenna array is segmented into distinct first and second antenna patterns at different elevations, with each pattern potentially optimized for specific frequency bands. This segmentation allows independent design and optimization of each antenna pattern for particular bands, simplifying the overall design process and making the multi-band capability more manageable compared to a monolithic antenna array design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces package size and enhances antenna gain by utilizing air cavities for resonance and multi-band radiation, mitigating signal transmission loss and increasing radiation directivity.
Implementation Method 1
The first antenna pattern and the second antenna pattern define an air cavity... utilizing air cavities for resonance
Data Source
AI summary
The present disclosure provides a semiconductor device package. The semiconductor device package includes a first antenna pattern disposed at a first elevation and a second antenna pattern disposed at a second elevation different from the first elevation. The first antenna pattern and the second antenna pattern define an air cavity. The semiconductor device package also includes a circuit layer. The air cavity is between the first antenna pattern, the second antenna pattern, and the circuit layer.