Antenna-on-Package Structure With Air Cavity for Smaller PCB Modules
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Solution Overview
Problem
Conventional antennae cannot be directly attached to printed circuit board modules of wireless communication devices, necessitating the use of U.FL connectors which increases PCB size, limiting miniaturization efforts and restricting antenna positioning.
Innovation Solution
An antenna structure is positioned above the encapsulant with supporting elements, electrically connected to electronic components through conductive elements, allowing for separate antenna patterns operating at different frequencies, and utilizing a resonant cavity with air to enhance signal transmission and reduce size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If U.FL connectors are used to connect external antennae to PCB modules, then antenna connection is achieved, but PCB size increases
Solution Approach 1:
The patent combines the antenna structure directly with the PCB module by integrating the antenna pattern into the PCB substrate itself, eliminating the need for separate U.FL connectors and external antenna attachments. This merging of functions allows the antenna to be formed as part of the PCB structure, thereby achieving reliable antenna connection while preventing PCB size increase.
2Reliability
If U.FL connectors are used for antenna attachment, then antenna connection is enabled, but device miniaturization is compromised
Solution Approach 1:
By merging the antenna structure with the PCB module through direct integration of the antenna pattern into the substrate, the patent eliminates additional components and attachment mechanisms. This integration achieves reliable antenna attachment while enabling device miniaturization by reducing the overall volume required for antenna implementation.
Solution Approach 2:
The patent utilizes the PCB substrate plane to form the antenna pattern, effectively using the existing two-dimensional space of the PCB for dual purposes (circuitry and antenna). This dimensional utilization allows antenna functionality to be achieved without adding vertical height or external protrusions, thereby enabling device miniaturization while maintaining reliable attachment.
3Reliability
If feed points are located on the same side of the PCB module, then signal output is achieved, but antenna positioning is limited
Solution Approach 1:
The patent segments the antenna pattern into multiple independent regions or elements distributed across the PCB substrate. This segmentation allows different portions of the antenna pattern to be positioned at various locations on the PCB, providing flexible antenna positioning while maintaining signal output functionality through the distributed feed point structure.
Solution Approach 2:
The patent transitions from a single-side feed point configuration to a distributed multi-location feed point arrangement across the PCB substrate plane. This spatial distribution in two dimensions enables versatile antenna positioning while maintaining effective signal output, as feed points can be strategically placed at multiple locations to support different antenna configurations and orientations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases antenna gain, enhances heat dissipation, and mitigates signal loss, facilitating the miniaturization of wireless communication devices while maintaining effective electromagnetic wave resonance.
Implementation Method 1
utilizing a resonant cavity with air to enhance signal transmission and reduce size
Data Source
AI summary
The present disclosure provides an electronic device, which includes an encapsulant, an electronic component, an antenna structure, and a first conductive element. The electronic component is disposed in the encapsulant. The antenna structure has an antenna pattern exposed to air and facing the encapsulant, and a first supporting element separating the antenna pattern from the encapsulant. At least a portion of the first conductive element is within the encapsulant, and electrically connects the antenna pattern to the electronic component by the first supporting element.