Antenna Package Circuit Board Bending Stress Management
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Solution Overview
Problem
The challenge is to enhance the mechanical and electrical reliability of antenna packages in image display devices, particularly in thin form factors, where bending stresses cause wiring damages, bonding failures, power loss, and signal noise due to circuit board connections, and the need for high-frequency communication requires improved radiation properties.
Innovation Solution
The solution involves an antenna package design with a circuit board and antenna device where the transmission line length is greater than or equal to the signal wiring length, incorporating a dielectric layer, radiator, and transmission line, along with a ground layer, to improve bending stability and radiation efficiency, and a connector region is optimized to reduce the circuit board's thickness and area, allowing for efficient connection to a driving integrated circuit chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the circuit board is bent to connect the antenna to the driving integrated circuit chip, then the connection between antenna and driving chip is achieved, but wiring damages and bonding failures occur due to bending stress
Solution Approach 1:
The patent divides the circuit board into multiple regions: a bending region that can flex to accommodate connection angles, a transmission region with protected wiring, and a bonding region with reinforced connections. This segmentation allows the circuit board to bend without causing wiring damages or bonding failures, as each region is optimized for its specific function.
Solution Approach 2:
The patent introduces an intermediary structure (such as a flexible connector or transition layer) between the rigid antenna assembly and the driving integrated circuit chip. This intermediary component absorbs bending stresses and prevents direct stress transmission to the wiring and bonding interfaces, thereby maintaining reliability while enabling flexible connection.
2Volume of moving object
If the circuit board is bent to accommodate thin form factor, then the device thickness is reduced, but power loss and signal loss increase due to bending stress
Solution Approach 1:
The patent applies different structural qualities to different regions of the circuit board. The bending region is designed with local flexibility to enable thin form factor, while the transmission region maintains rigid, optimized trace routing to minimize signal loss. The bonding region uses reinforced connections to prevent stress-induced failures. This localized optimization allows the device to achieve thinness without excessive power or signal loss.
Solution Approach 2:
The patent optimizes various parameters including trace width, trace spacing, dielectric thickness, and bending radius in different regions of the circuit board. By adjusting these parameters, the design minimizes signal loss and power consumption in the transmission region while maintaining the ability to bend for thin form factor. The transmission line impedance is carefully controlled to prevent reflections and signal degradation.
3Productivity
If the circuit board area is reduced to improve productivity, then manufacturing efficiency increases, but signal transmission quality deteriorates
Solution Approach 1:
The patent utilizes three-dimensional space more efficiently by optimizing the vertical stacking of circuit layers and utilizing via structures for inter-layer connections. This allows signal transmission paths to be routed through multiple dimensions rather than requiring large planar areas, thereby maintaining signal quality while reducing the overall circuit board footprint and improving manufacturing efficiency.
Solution Approach 2:
The patent employs curved or meandering transmission line designs instead of straight lines to achieve impedance matching and reduce signal reflections. These curved paths can be packed more efficiently into smaller areas while maintaining optimal signal transmission characteristics, thus reducing circuit board area without compromising signal quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the mechanical stability and electrical reliability of the antenna package, reduces power loss, and enhances radiation efficiency, enabling effective high-frequency communication while maintaining productivity by reducing the circuit board's size and area.
Implementation Method 1
an antenna device comprising a dielectric layer and an antenna unit disposed on the dielectric layer
Data Source
AI summary
An antenna package according to an embodiment of the present disclosure includes an antenna device including a dielectric layer and an antenna unit disposed on the dielectric layer, and a circuit board. The antenna unit includes a radiator and a transmission line extending from the radiator. The circuit board includes a core layer and a signal wiring disposed on the core layer and electrically connected to the antenna unit. The circuit board has a bonding region adhered to the antenna device, a signal transmission region including the signal wiring and a connect region including a connector connected to a terminal end portion of the signal wiring. A length of the transmission line of the antenna unit is greater than or equal to a length of the signal transmission region of the circuit board.