Antenna-in-Package Coaxial Interconnect for mmWave Signal Loss
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Solution Overview
Problem
The increasing demand for compact and lightweight electronic components in portable devices necessitates the development of semiconductor packages that integrate semiconductor chips and antennas, while maintaining efficient signal transmission and heat dissipation.
Innovation Solution
A semiconductor package design incorporating a supporting wiring structure with a redistribution dielectric and conductive layer, an expansion layer with a grounded frame and dielectric filling member, and a coaxial signal transmission line structure to connect the semiconductor chip to an antenna, minimizing signal loss and facilitating heat emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If an integrated semiconductor package is designed to be compact and lightweight, then the volume and weight of the package are reduced, but signal transmission efficiency and heat dissipation performance may deteriorate
Solution Approach 1:
The package is divided into functional zones: a first region containing the semiconductor chip and wiring structures for electrical connections, and a second region containing the antenna structure for wireless communication. This segmentation allows each region to be optimized independently - the first region for compact integration and the second region for effective signal radiation - thereby maintaining signal transmission efficiency while achieving compact overall package design.
Solution Approach 2:
The antenna structure extends in the thickness direction (vertical dimension) of the package, utilizing the third dimension for signal transmission. This dimensional transition allows the antenna to achieve effective radiation performance without increasing the planar footprint area, thus maintaining compact package volume while ensuring reliable wireless communication functionality.
2Volume of moving object
If the package size is reduced to make components compact, then portability is improved, but heat dissipation capability may worsen
Solution Approach 1:
The antenna structure is extracted and placed in a separate second region away from the semiconductor chip in the first region. This spatial separation extracts the heat-generating RF operations from the compact chip area, allowing heat to be dissipated independently in the antenna region without compromising the thermal management of the integrated chip and wiring structures in the compact first region.
3Device complexity
If wiring structures are integrated to reduce package size, then manufacturing complexity is reduced, but signal loss may increase
Solution Approach 1:
The wiring structures are segmented into two functional groups: those in the first region that provide electrical connections to the semiconductor chip, and those in the second region that form the antenna structure for wireless signal transmission. This segmentation allows the antenna wiring to be optimized for RF performance with appropriate trace widths, spacing, and grounding, thereby reducing signal loss while maintaining overall package integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a compact and lightweight semiconductor package with reduced signal loss and efficient heat dissipation, enabling smooth mmWave signal transmission and effective blocking between the antenna and semiconductor chip.
Implementation Method 1
the connection structure, a portion of the frame adjacent to the through hole, and a portion of the dielectric filling member form a signal transmission line having a coaxial structure
Implementation Method 2
a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure
Implementation Method 3
enabling smooth mmWave signal transmission and effective blocking between the antenna and semiconductor chip
Data Source
AI summary
A semiconductor package includes a supporting wiring structure including a first redistribution dielectric layer and a first redistribution conductive structure; a frame on the supporting wiring structure, having a mounting space and a through hole, and including a conductive material; a semiconductor chip in the mounting space and electrically connected to the first redistribution conductive structure; a cover wiring structure on the frame and the semiconductor chip and including a second redistribution dielectric layer and a second redistribution conductive structure; an antenna structure on the cover wiring structure; a connection structure extending in the through hole and electrically connecting the first redistribution conductive structure to the second redistribution conductive structure; and a dielectric filling member between the connection structure in the through hole and the frame and surrounding the semiconductor chip, the frame, and the connection structure.