Antenna Package Dummy Bumps RF Shielding
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Solution Overview
Problem
Conventional antenna-in-package (AiP) devices face challenges in RF shielding, particularly at millimeter wave frequencies, where effective shielding is crucial for improving the performance of radio-frequency integrated circuits (RFICs).
Innovation Solution
The implementation of a semiconductor device with a buffer layer between the RF circuit and a conductive layer, featuring a combination of functional and dummy bumps, where the dummy bumps are separated from the RF circuit by the buffer layer to provide additional RF shielding, and a feedline structure that couples antennas to the RF circuit, surrounded by a conductive layer acting as a shielding layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a conductive layer is placed close to the RF circuit for compact packaging, then the device footprint is reduced, but RF shielding performance deteriorates due to increased interference
Solution Approach 1:
The conductive layer is segmented into functional regions: dummy bumps are separated from the RF circuit by the buffer layer to provide shielding without electrical connection, while functional bumps maintain electrical connection for signal transmission. This segmentation allows simultaneous achievement of compact footprint and effective RF shielding.
Solution Approach 2:
The buffer layer acts as an intermediary between the RF circuit and the conductive layer. It provides RF shielding by blocking electromagnetic interference while allowing the device to maintain a compact footprint. The buffer layer mediates between the conflicting requirements of close spacing and interference protection.
2Ease of manufacture
If dummy bumps are electrically connected to the RF circuit, then manufacturing is simplified, but RF shielding performance deteriorates due to electrical interference
Solution Approach 1:
The bump structure is segmented into dummy bumps and functional bumps with different electrical connection requirements. Dummy bumps are isolated by the buffer layer to provide shielding, while functional bumps provide electrical connection. This segmentation resolves the contradiction between manufacturing simplicity and RF shielding effectiveness.
Solution Approach 2:
Different regions of the conductive layer have different properties: areas with dummy bumps provide RF shielding without electrical connection, while areas with functional bumps provide both shielding and electrical connection. This local differentiation allows simultaneous achievement of manufacturing simplicity and RF shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances RF shielding, improving the performance of AiP devices by reducing interference and maintaining the compact footprint of semiconductor devices, thereby addressing the challenges of RF shielding in high-frequency applications.
Implementation Method 1
a buffer layer arranged between the RF circuit and the conductive layer... at least one dummy bump which is maintained at a distance from the RF circuit and prevented from being electrically connected to the RF circuit by the buffer layer
Implementation Method 2
a plurality of bumps disposed over the buffer layer and electrically connected to the conductive layer, the plurality of bumps comprising at least one functional bump electrically connected to the RF circuit
Data Source
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AI summary
A semiconductor system includes a semiconductor chip comprising a RF circuit, a buffer layer over the RF circuit and a plurality of bumps over the buffer layer, wherein the plurality of bumps comprising at least one functional bump electrically connected to the RF circuit, and at least one dummy bump which is maintained at a distance from the RF circuit and prevented from being electrically connected to the RF circuit by the buffer layer, a conductive layer disposed over the semiconductor chip and coupled to the plurality of bumps through a plurality of vias, a feedline structure disposed over the conductive layer, wherein the feedline structure is electrically coupled to the RF circuit, and a plurality of antennas disposed over the feedline structure, wherein at least one antenna of the plurality of antennas is coupled to the RF circuit through the feedline structure.