Antenna-in-Package EMI Shield Layout for High-Speed Semiconductor Links

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Solution Overview

Problem

As communication transfer speeds in semiconductor devices increase, they become susceptible to electromagnetic interference (EMI) due to the high density of small components and integrated circuitry.

Innovation Solution

Incorporating an electromagnetic interference (EMI) shield between the semiconductor die and the antenna structure, electrically coupled to a ground plane, to shield the semiconductor die from electromagnetic radiation generated by the antenna and vice versa.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If communication transfer speeds are increased in semiconductor devices, then data transmission capability is improved, but electromagnetic interference susceptibility increases

Engineering Contradiction:

Improvecommunication transfer speedVSAvoidelectromagnetic interference susceptibility

Core Design Contradiction:

SpeedVSObject-affected harmful factors

Solution Approach 1:

An EMI shield is introduced as an intermediary component between the antenna structure and the semiconductor die. This shield acts as a mediator that blocks electromagnetic interference from reaching the die while allowing the antenna to operate at high communication speeds. The shield is electrically connected to a ground plane to effectively dissipate electromagnetic energy.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If high density of small components and integrated circuitry are used, then device integration is improved, but electromagnetic interference susceptibility increases

Engineering Contradiction:

Improvedevice integration densityVSAvoidelectromagnetic interference susceptibility

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The EMI shield serves as a protective intermediary that allows high-density integration of components while preventing electromagnetic interference. The shield creates an isolated environment for the densely packed circuitry, enabling maintainability of high integration density without suffering from increased EMI susceptibility.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Object-affected harmful factors

If EMI shield is added between semiconductor die and antenna structure, then electromagnetic interference protection is improved, but device complexity increases

Engineering Contradiction:

Improveelectromagnetic interference protectionVSAvoiddevice structural complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The EMI shield is implemented as a thin conductive layer or foil that can be easily integrated into the existing device structure. This thin-film approach provides effective EMI protection while minimizing the increase in device complexity and maintaining a compact form factor.

Inventive Principle:

Principle #30Flexible shells and thin films

4Object-affected harmful factors

If EMI shield electrically coupled to ground plane is used, then electromagnetic radiation shielding effectiveness is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveelectromagnetic radiation shielding effectivenessVSAvoidmanufacturing complexity

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The EMI shield is electrically connected to an existing ground plane structure within the device, merging two functional elements into a unified EMI protection system. This integration approach enhances shielding effectiveness while avoiding the need for separate manufacturing processes, thereby reducing overall manufacturing complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents interference between the semiconductor die and the antenna structure, allowing for higher communication speeds without interference, compared to conventional semiconductor devices.

Implementation Method 1

An electromagnetic interference (EMI) shield is between the semiconductor die and the antenna structure to shield at least the semiconductor die from electromagnetic radiation generated by the antenna structure and/or to shield at least the antenna structure from interface generated by the semiconductor die

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS20250038127A1Semiconductor packages and associated methods with antennas and EMI isolation shields

Publication Date: 2025.01.30 LODESTAR LICENSING GROUP LLC

AI summary

Semiconductor devices with antennas and electromagnetic interference (EMI) shielding, and associated systems and methods, are described herein. In one embodiment, a semiconductor device includes a semiconductor die coupled to a package substrate. An antenna structure is disposed over and/or adjacent the semiconductor die. An electromagnetic interference (EMI) shield is disposed between the semiconductor die and the antenna structure to shield at least the semiconductor die from electromagnetic radiation generated by the antenna structure and/or to shield the antenna structure from interference generated by the semiconductor die. A first dielectric material and/or a thermal interface material can be positioned between the semiconductor die and the EMI shield, and a second dielectric material can be positioned between the EMI shield and the antenna structure. In some embodiments, the semiconductor device includes a package molding over at least a portion of the antenna, the EMI shield, and/or the second dielectric material.