Antenna-in-Package FDD Layout With Interleaved Tx/Rx Isolation
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Solution Overview
Problem
Existing antenna-in-package constructions face interference between uplink and downlink signals due to non-optimal spacing and overlapping areas of transmitting and receiving array antennas, which are not effectively resolved by current staggered arrangements.
Innovation Solution
An antenna-in-package construction with frequency division duplex technology, featuring interleaved alternating sequences of transmitting and receiving antenna arrays, surrounded by metal isolation pillars, and distinct dielectric layers with different dielectric constants, ensuring optimal spacing and reducing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If transmitting array antennas and receiving array antennas are arranged in a staggered arrangement to resolve interference, then the area of transmitting array antenna can be smaller than receiving array antenna, but the transmitting array antenna and receiving array antenna partially overlap each other causing uplink and downlink signals to still interfere with each other
Solution Approach 1:
The patent divides the antenna array into separate transmitting and receiving segments with distinct spacing arrangements. Transmitting antennas have a first spacing while receiving antennas have a second spacing, creating segmented zones that prevent overlap and interference between uplink and downlink signals.
Solution Approach 2:
The patent applies different spacing characteristics to different parts of the antenna system. The transmitting array uses one spacing value while the receiving array uses another, optimizing each region's performance for its specific function and preventing harmful interference through localized quality differentiation.
2Volume of moving object
If transmitting array antennas and receiving array antennas are arranged with non-optimal spacing, then device size can be reduced through miniaturization, but uplink and downlink signals interfere with each other
Solution Approach 1:
The patent changes the spacing parameters of the antenna elements to achieve optimal performance. By adjusting the distance between transmitting antennas and between receiving antennas to specific values, the system minimizes interference while maintaining a compact form factor suitable for miniaturization.
3Object-affected harmful factors
If transmitting array antennas and receiving array antennas are arranged with optimal spacing, then signal interference is minimized, but the space between transmitting antenna and adjacent receiving antenna does not adhere to optimal ratio
Solution Approach 1:
The patent applies different spacing characteristics to different parts of the antenna system. The transmitting array uses one spacing value while the receiving array uses another, optimizing each region's performance for its specific function and preventing harmful interference through localized quality differentiation.
Data Source
AI summary
An antenna-in-package construction includes a chip layer, a second dielectric layer, and a first dielectric layer stacked in order. The first dielectric layer has a dielectric constant more than 3.5. The antenna-in-package construction includes a transmitting antenna array, a receiving antenna array, and metal isolated pillars. The transmitting antenna array extends from the chip layer to the first dielectric layer through the second dielectric layer. The receiving antenna array extends from the chip layer to the second dielectric layer. The transmitting antenna array and the receiving antenna array are arranged in an alternating interleaved sequence. The metal isolated pillars surround each transmitting antenna and each receiving antenna. The chip layer includes at least one transmitting chip and at least one receiving chip. The transmitting chip and the receiving chip are electrically connected to the transmitting antenna array and the receiving antenna array, respectively.