Antenna Integrated Circuit Package with Ground Plane Isolation
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Solution Overview
Problem
Existing integrated circuit package apparatuses with antennas suffer from reduced radiation efficiency and sensitivity due to the plastic package body's electromagnetic energy loss, and poor isolation between the antenna and other components, leading to signal interference.
Innovation Solution
The integrated circuit package apparatus employs a package substrate with at least one ground plane, where the antenna is deployed on one side and the chip and connection circuit on the other, using a first metal through hole for connection, without a plastic package body to minimize signal loss and interference, and optionally includes anti-pads and multiple ground planes for enhanced isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a plastic package body is used to cover the chip, then the chip is protected and isolated from the antenna, but electromagnetic energy loss increases and radiation efficiency decreases
Solution Approach 1:
The patent removes the plastic package body from the structure, extracting the harmful element that caused electromagnetic energy loss. The chip is mounted directly on the circuit board without encapsulation, eliminating the material that absorbed and dissipated antenna signals while maintaining protection through alternative means.
Solution Approach 2:
The patent applies localized protection only where necessary - the chip is protected from physical damage through mounting structures and selective shielding, rather than complete encapsulation. The ground plane provides localized electromagnetic shielding beneath the antenna area, allowing signal transmission in other regions.
2Reliability
If the antenna is deployed on the plastic package body surface, then the antenna is isolated from the chip, but isolation between the antenna and connection circuit is poor and signal interference occurs
Solution Approach 1:
The patent introduces a ground plane as an intermediary element between the antenna and the connection circuit. This conductive layer acts as a shield that redirects electromagnetic fields, preventing direct coupling and interference between the antenna signal and the connection circuit while maintaining proper signal isolation.
Solution Approach 2:
The patent moves the antenna from a three-dimensional space above the chip to a two-dimensional planar structure on the circuit board surface. This dimensional change allows the antenna to be coplanar with the circuit board, enabling better integration and controlled impedance matching while maintaining isolation through the ground plane.
3Loss of energy
If the plastic package body is removed, then electromagnetic energy loss is reduced and radiation efficiency improves, but chip protection and isolation are compromised
Solution Approach 1:
The patent removes the plastic package body that caused electromagnetic energy loss, extracting the harmful encapsulation material. The chip is mounted directly on the circuit board, eliminating the lossy dielectric material that absorbed antenna signals.
Solution Approach 2:
The ground plane serves as an intermediary that provides electromagnetic shielding and signal isolation without requiring plastic encapsulation. This conductive layer protects the chip area from electromagnetic interference while allowing the antenna to radiate freely in other directions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves antenna sensitivity and transmission efficiency by reducing signal interference and electromagnetic losses, enhancing the reliability and stability of the integrated circuit package apparatus.
Implementation Method 1
the antenna is isolated from the chip and the connection circuit using the at least one ground plane
Implementation Method 2
the antenna is connected to the chip using the connection circuit and a first metal through hole
Data Source
AI summary
An integrated circuit package apparatus deployed with an antenna and a method for manufacturing an integrated circuit package apparatus, where the integrated circuit package apparatus includes a package substrate, an antenna, a chip, and a connection circuit. The package substrate includes at least one ground plane, the antenna is deployed on an external surface of one side of the package substrate and is located on one side of the at least one ground plane, the chip and the connection circuit are deployed on the other side of the at least one ground plane, where the antenna is isolated from the chip and the connection circuit using the at least one ground plane, and the antenna is coupled to the chip using the connection circuit and a first metal through hole in a thickness direction of the package substrate.