Antenna Package Structure for Thin Heterogeneous Substrates
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Solution Overview
Problem
Existing semiconductor device packages face challenges in integrating heterogeneous substrates for wireless communication devices, such as cell phones, without affecting the performance of the antenna or the entire device package.
Innovation Solution
A semiconductor device package is designed with a first device having a substrate with a specific dielectric constant, a second device including a dielectric element, an antenna, and a reinforcing element with different dielectric constants, and a spacer to define the distance between the devices, allowing for efficient integration while maintaining performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If heterogeneous substrates are integrated to reduce thickness and enhance antenna gain, then antenna performance is improved, but structural strength and warpage resistance deteriorate
Solution Approach 1:
The patent employs a composite substrate structure comprising a first substrate and a second substrate with different dielectric constants bonded together. The first substrate provides mechanical strength while the second substrate optimizes antenna performance. This composite approach allows the integration of heterogeneous substrates to reduce overall thickness and enhance antenna gain while maintaining structural integrity through the synergistic combination of materials with complementary properties.
2Length of moving object
If heterogeneous substrates are integrated to reduce thickness and enhance antenna gain, then antenna performance is improved, but warpage control deteriorates
Solution Approach 1:
The patent applies local quality by positioning substrates with different dielectric constants in specific locations within the composite structure. The first substrate with a first dielectric constant is placed in a region requiring mechanical stability, while the second substrate with a second dielectric constant is positioned to optimize antenna performance. This spatial differentiation of material properties allows the structure to simultaneously achieve thinness, antenna gain enhancement, and warpage control by matching material characteristics to functional requirements at different locations.
3Adaptability or versatility
If multiple dielectric layers with different dielectric constants are used to improve antenna performance, then bandwidth is enlarged, but device complexity increases
Solution Approach 1:
The patent implements multi-functionality by designing a composite substrate structure where each substrate layer serves multiple purposes. The first substrate provides mechanical support, electrical isolation, and contributes to antenna resonance characteristics. The second substrate simultaneously provides electrical isolation and optimizes antenna radiation properties. This multi-functional design enables bandwidth enlargement through the combined dielectric properties while avoiding excessive complexity by integrating multiple functions into a unified two-layer structure rather than adding separate components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the integration of heterogeneous substrates, enhancing the gain and reducing the thickness of the semiconductor device package, while increasing the structural strength and reducing warpage, thus improving the overall performance and manufacturing efficiency.
Implementation Method 1
The dielectric element has a second dielectric constant less than the first dielectric constant
Implementation Method 2
the reinforcing element has a third dielectric constant greater than the first dielectric constant
Data Source
AI summary
The present disclosure provides a semiconductor device package including a first device, a second device, and a spacer. The first device includes a substrate having a first dielectric constant. The second device includes a dielectric element, an antenna, and a reinforcing element. The dielectric element has a second dielectric constant less than the first dielectric constant. The antenna is at least partially within the dielectric element. The reinforcing element is disposed on the dielectric element, and the reinforcing element has a third dielectric constant greater than the first dielectric constant. The spacer is disposed between the first device and the second device and configured to define a distance between the first device and the second device.