Fan-Out Antenna-in-Package Structure for Low-Loss mmWave Integration

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Solution Overview

Problem

Conventional fan-out wafer level packaging (FOWLP) for antennas in packages suffers from high conduction loss, surface wave activity, and deformation due to thermal expansion mismatch, limiting the efficiency and integration density of millimeter wave wireless communication systems.

Innovation Solution

An antenna-in-package design incorporating a dielectric resonant antenna with a dummy chip, a redistribution layer, and a conductive pattern to enhance connectivity and reduce thermal deformation, featuring a through mold via for improved bandwidth and gain.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a planar antenna is manufactured using the RDL pattern in conventional FOWLP, then the integration density is increased, but the antenna efficiency deteriorates due to high conduction loss and surface wave activity

Engineering Contradiction:

Improveintegration densityVSAvoidantenna efficiency

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent changes the antenna configuration from a two-dimensional planar RDL pattern to a three-dimensional folded structure. This parameter change in spatial arrangement reduces the effective electrical length while maintaining physical compactness, thereby reducing conduction losses and surface wave excitations that plague planar designs at millimeter wave frequencies

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The antenna employs a folded configuration where the radiating element is nested within itself through multiple bends and folds. This nesting approach allows the antenna to achieve a compact form factor suitable for integrated packaging while maintaining the electrical performance of a longer antenna structure, resolving the contradiction between compact integration and efficient radiation

Inventive Principle:

Principle #7Nested doll (Nesting)

2Ease of manufacture

If the FOWLP packaging process is used to integrate the antenna and chip, then the manufacturing complexity is reduced, but deformation occurs due to mismatch in the coefficient of thermal expansion

Engineering Contradiction:

Improvemanufacturing complexityVSAvoidstructural stability

Core Design Contradiction:

Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The patent explicitly addresses thermal expansion mismatch by designing the antenna structure with compensation mechanisms for the different thermal expansion coefficients of the semiconductor chip and molding compound. The folded antenna configuration and its mounting structure are designed to accommodate thermal stresses without causing deformation or performance degradation during the FOWLP packaging process

Inventive Principle:

Principle #37Thermal expansion

3Volume of moving object

If the antenna is fully encapsulated in the molding compound, then the integration compactness is improved, but the electromagnetic interference is increased due to surface wave activity

Engineering Contradiction:

Improveintegration compactnessVSAvoidelectromagnetic interference

Core Design Contradiction:

Volume of moving objectVSObject-generated harmful factors

Solution Approach 1:

The patent utilizes the molding compound encapsulation strategically - while maintaining compact integration, the design incorporates air gaps or low-dielectric regions around critical portions of the folded antenna structure. This selective encapsulation approach preserves the benefits of compact packaging while minimizing the harmful effects of the molding compound's high dielectric constant that would otherwise increase surface wave activity and electromagnetic interference

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design achieves high integration density, reduced manufacturing failures, suppressed electromagnetic interference, and improved bandwidth and gain, enabling compact and efficient integration for millimeter wave wireless communication.

Implementation Method 1

an antenna configured to transmit and receive a wireless signal

Methodology Applied

Scientific EffectElectromagnetic resonance: Resonance

Implementation Method 2

an encapsulant configured to encapsulate at least a portion of each of the antenna and the integrated circuit chip

Methodology Applied

Scientific EffectPhysical containment: Physical Containment

Implementation Method 3

a conductive pattern disposed in the insulating layer and electrically connected to the antenna or the integrated circuit chip

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 4

the antenna layer may further include a through mold via electrically connected to each of the conductive pattern and the antenna

Methodology Applied

Scientific EffectElectrical conduction through dielectric: Conduction (electrical)

Data Source

PatentUS20250350019A1Antenna-in-package

Publication Date: 2025.11.13 POSTECH ACADEMY INDUSTRY FOUNDATION

AI summary

Disclosed is an antenna-in-package, and more particularly, an antenna-in-package using fan-out wafer level packaging. The antenna-in-package according to an embodiment includes an antenna layer including: an antenna configured to transmit and receive a wireless signal; an integrated circuit chip configured to control the antenna; and an encapsulant configured to encapsulate at least a portion of each of the antenna and the integrated circuit chip; and a redistribution layer including: an insulating layer; and a conductive pattern disposed in the insulating layer and electrically connected to the antenna or the integrated circuit chip.