Antenna-in-Package Layout With Exposed Main Antenna
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face constraints in design and increased performance errors due to the integration of antennas, limiting the freedom of design and stability of the integration between semiconductor chips and antenna modules.
Innovation Solution
A semiconductor package design that stably integrates a semiconductor chip and an antenna module by exposing the main antenna and covering the sub-antenna, using a redistribution structure for electrical connection, and incorporating a molding member to protect and position the components, allowing for independent bodies and reduced interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the antenna is integrated into the semiconductor package, then the wireless communication function is achieved, but the design freedom is constrained and performance errors occur
Solution Approach 1:
The antenna module is separated from the semiconductor chip into an independent component. The semiconductor chip and antenna module are packaged together in a single package but remain physically distinct, allowing independent optimization of each component while achieving integrated functionality.
Solution Approach 2:
A redistribution structure serves as an intermediary component that electrically connects the semiconductor chip to the antenna module. This separate connection structure allows flexible routing and impedance matching without constraining the antenna design.
2Reliability
If the antenna pattern is formed in the redistribution layer, then the antenna function is integrated, but the radiation performance is insufficient
Solution Approach 1:
The antenna function is segmented from the redistribution layer and implemented as a dedicated antenna module with separate antenna elements. This allows the antenna to be optimized for radiation performance independently from the signal distribution functions of the redistribution layer.
Solution Approach 2:
The antenna elements are arranged in specific three-dimensional configurations (e.g., vertical stacking, angular orientations) to achieve desired radiation patterns and polarization characteristics, moving beyond planar two-dimensional layouts.
3Reliability
If the main antenna is exposed and sub-antenna is covered, then the radiation performance is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
Different portions of the antenna module have different exposure characteristics. The main antenna element is exposed to the external environment for optimal radiation, while the sub-antenna element is covered by the molding member for protection and integration. This localized differentiation optimizes performance where needed while maintaining manufacturability.
Data Source
AI summary
A semiconductor package includes a semiconductor chip comprising an active surface and an inactive surface facing each other. At least one antenna module is arranged adjacent to the semiconductor chip. The at least one antenna module comprises a main antenna and a sub-antenna. A redistribution structure is disposed on the semiconductor chip and the at least one antenna module. The redistribution structure electrically connects the active surface of the semiconductor chip to the at least one antenna module. A molding member surrounds the semiconductor chip and the at least one antenna module. The inactive surface of the semiconductor chip and the main antenna are exposed from the molding member, and the sub-antenna is covered by the molding member.