Antenna-in-Package Layout for Low-Loss Millimeter-Wave Signals
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Solution Overview
Problem
Existing semiconductor packages experience significant transmission loss of high-frequency signals, particularly in millimeter wave communications, due to the integration of antennas and RFICs, which is not effectively addressed by current technologies.
Innovation Solution
A semiconductor package design that includes a dielectric layer with a ground member, a redistribution structure with fine-pitch conductors, and a shielding layer to reduce transmission loss by minimizing signal interference and improving signal integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If antennas and RFICs are integrated in a semiconductor package for 5G communication, then device functionality is improved, but transmission loss of high-frequency signals increases
Solution Approach 1:
A dielectric layer with high dielectric constant (Dk>10) is introduced as an intermediary medium between the antenna and RFIC to reduce signal transmission loss. The high Dk value confines the electromagnetic field more effectively, reducing radiation loss and improving signal integrity at millimeter wave frequencies.
Solution Approach 2:
The dielectric constant parameter of the insulating layer is changed to a high value (Dk>10) to improve signal transmission. By selecting materials with higher dielectric constants, the electromagnetic field is better confined, reducing transmission loss while maintaining the integrated package structure.
2Ease of manufacture
If conventional insulating layers are used in the antenna structure, then manufacturing simplicity is maintained, but signal transmission loss increases
Solution Approach 1:
The dielectric constant parameter of the insulating layer is changed to a high value (Dk>10) to improve signal transmission. By selecting materials with higher dielectric constants, the electromagnetic field is better confined, reducing transmission loss while maintaining the integrated package structure.
Solution Approach 2:
Composite dielectric materials with high dielectric constant are used in the insulating layer to reduce signal loss. These composite materials combine different dielectric components to achieve the desired high Dk value while maintaining manufacturability through standard semiconductor fabrication processes.
3Volume of moving object
If the antenna member is placed close to the ground member for compact design, then device size is reduced, but signal interference increases
Solution Approach 1:
The dielectric constant of the layer between the antenna and ground is increased (Dk>10), which electrically isolates the antenna from the ground plane. This higher dielectric constant reduces the coupling between antenna and ground, minimizing signal interference while allowing closer physical placement for compact design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces transmission loss and improves signal integrity by using a dielectric layer with a high dielectric constant, fine-pitch redistribution conductors, and a shielding layer, enhancing performance in millimeter wave communications.
Implementation Method 1
a dielectric layer, an antenna member configured to transmit and receive a signal through the first surface in the dielectric layer
Implementation Method 2
a shielding layer surrounding a surface of the second encapsulant
Data Source
AI summary
A semiconductor package includes an antenna structure including an antenna member transmitting and receiving a signal through the first surface in the dielectric layer, a connection via extending from the antenna member toward the second surface, and a ground member spaced apart from the connection via, a frame surrounding the side surface of the antenna structure, a first encapsulant covering the antenna structure and the frame, a redistribution structure on the second surface and including an insulating layer in contact with the antenna structure and the frame, and a redistribution conductor electrically connected to the ground member and the connection via in the insulating layer, a first semiconductor chip on the redistribution structure and electrically connected to the antenna member through the redistribution conductor, a second encapsulant encapsulating the first semiconductor chip on the redistribution structure, and a shielding layer surrounding a surface of the second encapsulant.