Antenna-in-Package Structure Without Flexible Substrates
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Solution Overview
Problem
The manufacturing process for advanced semiconductor devices with integrated antennas using flexible substrates is expensive and complex, necessitating a more cost-effective and simplified integrated antenna-in-package (AiP) structure.
Innovation Solution
The development of an integrated AiP structure that mounts semiconductor die directly to a substrate with an integrated antenna, eliminating the need for flexible substrates and simplifying the manufacturing process by using a single substrate for both the semiconductor die and the antenna.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If flexible substrates are used to attach antennas to semiconductor packages, then antenna orientation flexibility is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent combines the antenna and semiconductor package into a single integrated structure where the antenna is formed directly on the package substrate. This merging eliminates the need for separate flexible substrates and multiple attachment steps, thereby reducing manufacturing complexity while maintaining adaptability through integrated antenna design
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for the semiconductor die, electrical interconnection through conductive traces, and antenna radiation elements. This multi-functionality eliminates the need for dedicated flexible substrates, simplifying the overall manufacturing process while maintaining orientation flexibility through the substrate's inherent properties
2Adaptability or versatility
If flexible substrates are used to attach antennas to semiconductor packages, then antenna orientation flexibility is improved, but manufacturing cost increases
Solution Approach 1:
The antenna is merged with the package substrate into a single integrated structure, eliminating the need for separate flexible substrate materials and assembly steps. This consolidation reduces material costs and manufacturing expenses while maintaining the ability to achieve various antenna orientations through the integrated design
Solution Approach 2:
The patent extracts the antenna function from the separate flexible substrate and integrates it directly into the package substrate. This extraction eliminates the need for expensive flexible substrate materials and their associated handling and assembly processes, thereby reducing manufacturing cost while preserving orientation flexibility
Data Source
AI summary
A semiconductor device includes a first substrate. An electrical component is disposed over the first substrate. A board-to-board connector is disposed over the first substrate. An encapsulant is deposited over the first substrate and electrical component to form a subpackage. The board-to-board connector remains exposed from the encapsulant. A contact pad is formed on a side surface of the subpackage. The subpackage is mounted to an antenna through the contact pad.