Antenna Package Layout With Overlap Structure for Lower Module Height
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Solution Overview
Problem
Conventional antenna devices face complexity in manufacturing and circuit design due to improper layout of related circuits and the antenna layer, leading to increased complexity and costs.
Innovation Solution
The antenna device features a semiconductor package and an antenna substrate with a specific layout where the input pad is on the substrate's surface, allowing for a projected region that overlaps, reducing module height and simplifying manufacturing processes by separating RF passive circuitry and semiconductor components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the input pad is disposed on the semiconductor package, then the antenna device achieves proper electrical connection, but the module height increases and manufacturing complexity increases
Solution Approach 1:
The patent moves the input pad from the vertical dimension (on top of the semiconductor package) to the horizontal dimension (on the antenna substrate surface), allowing the antenna substrate to extend laterally beyond the package boundaries. This dimensional shift reduces module height while maintaining electrical connectivity through the bonding pad structure.
2Reliability
If the antenna layer and related circuits are integrated in conventional layout, then electrical connection is achieved, but manufacturing processes and circuit design become more complex
Solution Approach 1:
The patent segments the antenna device into distinct functional zones: the semiconductor package for active components, the bonding pad for interconnection, and the antenna substrate for passive circuits and antenna elements. This spatial segmentation allows each component to be optimized and manufactured independently, then assembled together, reducing overall manufacturing complexity.
Solution Approach 2:
The bonding pad serves as an intermediary element between the semiconductor package and the antenna substrate. It provides a standardized interface that simplifies the connection process and decouples the design constraints of the package from those of the antenna circuit, thereby reducing manufacturing complexity.
3Adaptability or versatility
If the antenna substrate and semiconductor package are separated, then design flexibility and electromagnetic shielding are enhanced, but manufacturing complexity increases
Solution Approach 1:
The bonding pad structure serves multiple functions simultaneously: it provides electrical connection, mechanical support, and a standardized assembly interface. This multi-functionality allows the antenna substrate and semiconductor package to be separated for independent optimization while simplifying the final assembly process, thereby reducing assembly complexity despite the separation.
Data Source
AI summary
An antenna device includes an antenna substrate and a semiconductor package. The antenna substrate includes a base and an input pad, wherein the base has a first surface, and the input pad is disposed on a first portion of the first surface. The semiconductor package is disposed on the first surface of the semiconductor package. The semiconductor package has a second surface facing the first surface, and an entirety of the second surface and a second portion of the first surface overlap.