Antenna Package With Integrated Resistive Lines
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Solution Overview
Problem
Conventional wireless communications package structures for millimeter wave applications face challenges in designing high-performance phased array antenna systems due to space constraints and the difficulty in suppressing surface waves, which are essential for compact and efficient antenna designs, especially in industrial applications like 5G cell towers.
Innovation Solution
The proposed solution involves a multilayer package substrate with a planar lid having a phased array antenna pattern, where active and dummy antenna elements are strategically aligned with resistive transmission lines and feed lines, and an embedded air cavity is created between the antenna array and the substrate to suppress surface waves, allowing for optimal radiation characteristics and compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional surface-wave suppressing methods are used in antenna designs, then surface waves are suppressed, but the additional structures occupy too much space
Solution Approach 1:
The patent combines the surface wave suppression function with the ground plane structure by integrating resistive transmission lines into the existing ground plane layers. This merging eliminates the need for separate suppression structures, achieving surface wave control without increasing package area.
Solution Approach 2:
The ground plane structures serve multiple functions: they provide the traditional ground reference for antenna operation and simultaneously act as surface wave suppressors through the integrated resistive transmission lines. This multi-functionality resolves the space constraint by making existing structures do dual work.
2Reliability
If complex and costly packaging technologies are used, then high performance is achieved, but cost and complexity increase
Solution Approach 1:
The patent merges the antenna feed network and surface wave suppression structures into a unified ground plane design using standard PCB fabrication techniques. This integration achieves high performance without requiring complex multi-step packaging processes.
Solution Approach 2:
The patent uses conventional, cost-effective PCB materials and standard resistive terminations instead of expensive specialized packaging materials. The resistive transmission lines are implemented using standard thin-film or thick-film resistor technologies that are widely available and economical.
3Ease of manufacture
If conventional packaging technologies are used, then manufacturing is simpler, but radiation efficiency decreases due to losses
Solution Approach 1:
The patent changes the electrical parameters of the ground plane by integrating resistive transmission lines with specific impedance values. This parameter modification allows the ground plane to actively suppress surface waves while maintaining compatibility with conventional manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances radiation efficiency, reduces mutual coupling, and eliminates the need for additional surface wave suppression structures, resulting in a compact, high-performance integrated antenna system suitable for millimeter-wave frequencies.
Implementation Method 1
The package cover is bonded to the multilayer package substrate with the first surface of the planar lid fixedly disposed at a distance from the first surface of the multilayer package substrate to provide an air space between the planar antenna array and the first surface of the multilayer package substrate
Data Source
AI summary
Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.